METAL CLEANING POLISHING COMPOUND

Brand	Owner (click to sort)	Address	Description
PROPER CARE FOR COPPERWARE	AGHAJANIAN & COMPANY, INC.	806 Sharon Drive 2-C Cleveland OH 44145	METAL CLEANING AND POLISHING COMPOUND;
PROPER CARE FOR COPPERWARE	KENERSON-EDGAR COMPANY, THE	12630 SUPERIOR AVE. CLEVELAND OH	METAL CLEANING AND POLISHING COMPOUND;
TOP BRASS	WYATT CHEMICAL CORPORATION	300 Steele Point Dr Roswell GA 30076	METAL CLEANING AND POLISHING COMPOUND;BRASS;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

A polishing pad is cleaned of Cu CMP by-products, subsequent to planarizing a wafer, to reduce pad-glazing by applying to the polishing pad surface a composition comprising about 0.1 to about 3.0 wt. % of at least one organic compound having one or more amine or amide groups, an acid or a base in an amount sufficient to adjust the pH of the composition to about 5.0 to about 12.0, the remainder water. Embodiments comprise ex situ cleaning of a rotating polishing pad by applying a solution having a pH of about 5.0 to about 12.0 at a flow rate of about 100 to about 600 ml/min. for about 3 to about 20 seconds after polishing a wafer having a Cu-containing surface and then removing the cleaning solution from the polishing pad by high pressure rinsing with water.