MEASURING PROBES

Brand Owner (click to sort) Address Description
RENISHAW RENISHAW PLC NEW MILLS, WOTTON-UNDER-EDGE GLOUCESTERSHIRE GL128JR United Kingdom MEASURING PROBES, STYLI FOR MEASURING PROBES, MEASURING PROBE HEADS, ADAPTERS, EXTENSION BARS, KNUCKLE JOINTS AND HOLDERS FOR MEASURING PROBES, MEASURING PROBE STORAGE AND RETRIEVAL RACKS, LASER SCANNING MEASURING PROBES, MEASURING INSTRUMENTS; NAMELY, LASER INTERFEROMETERS; MOTORIZED MEASURING PROBES, MOTORIZED DRIVES FOR MEASURING PROBES, INDUCTIVE DATA TRANSMITTERS, INTERFACE UNITS, POWER SUPPLIES, OPTICAL DATA TRANSMITTERS, BATTERY CHARGERS, SWITCH BOXES, CONTROLLERS, TRANSMITTERS, GAUGES, MACHINE CHECKING GAUGES, MEASURING APPARATUS AND INSTRUMENTS; NAMELY, MAGNETIC SCALES, OPTICAL SCALES, SCALE READERS;[ INTERFACE BOARDS FOR NETWORKING MACHINE TOOLS;] PARTS FOR ALL THE AFORESAID GOODS, INCLUDING LASERS; COMPUTER PROGRAMS FOR USE WITH MEASURING APPARATUS AND INSTRUMENTS AND COMPUTER PROGRAMS MANUALS SOLD AS A UNIT;
SILVERBACK MetrologyWorks, Inc. 27208 E US HWY 24 Buckner MO 64016 Measuring probes, namely, spherically mounted retroreflectors in the nature of optical reflectors and optical targets for use with portable coordinate measuring machines;SILVER BACK;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A control unit of a wafer prober for implementing wafer examination, using a probe card including a multiple number of probes, executes a multiple number of measuring operations by bringing the probes of the probe card into contact with bonding pads formed on a wafer and by measuring the electric characteristics between predetermined pads of the bonding pads, each of the measuring operations being implemented after varying the relative position between the probe card and the wafer, in directions parallel to the face of the wafer. The control unit, upon execution of each of the measuring operations, implements the measuring operation after adjusting the relative position between the probe card and the wafer so that the contact position of each probe of the probes against each pad of the bonding pads is separated from all the positions at which the probes have already touched that pad of the bonding pads for a predetermined number of different times.