MEASURING EQUIPMENTS MEASURING CARBON

Brand Owner (click to sort) Address Description
DOWA DOWA HOLDINGS CO., LTD. 14-1, Sotokanda 4-Chome, Chiyoda-ku Tokyo 101-0021 Japan MEASURING EQUIPMENTS FOR MEASURING CARBON DIOXIDE DENSITY WITHIN A FURNACE, LIGHT EMITTING DIODE CHIPS, GALLIUM/ARSENITE WAFERS FOR USE IN MANUFACTURING SEMICONDUCTORS AND BATTERY MATERIALS INCLUDING ZINC POWDERS, SILVER OXIDE POWDERS, LITHIUM-COBALT ALLOY POWDERS, AND LITHIUM-NICKEL ALLOY POWDERS;METALS, NAMELY, SILVER POWDERS FOR USE IN THE MANUFACTURE OF CONDUCTIVE PASTES, IRON POWDERS FOR USE IN MANUFACTURING VIDEOTAPES, FERRITE POWDERS FOR USE IN MANUFACTURING MAGNETS, COPPER ALLOYS FOR USE IN MANUFACTURING SPRINGS AND REED FRAMES, COPPER ALLOY WIRES, AND HIGH PURITY METALS INCLUDING GALLIUM, INDIUM, COPPER, ANTIMONY, CADMIUM, ZINC, TELLURIUM, GERMANIUM, SILVER, SELENIUM, BISMUTH AND MAGNESIUM;SILVER OXIDE POWDERS FOR USE IN MANUFACTURING DRY BATTERY OR CELL ELECTRODES;The term DOWA translates from Chinese to mean equally harmonized or joined together.;INDUSTRIAL FURNACES;
DOWA DOWA MINING CO., LTD. 8-2, Marunouchi 1-chome Chiyoda-ku, Tokyo Japan MEASURING EQUIPMENTS FOR MEASURING CARBON DIOXIDE DENSITY WITHIN A FURNACE, LIGHT EMITTING DIODE CHIPS, GALLIUM/ARSENITE WAFERS FOR USE IN MANUFACTURING SEMICONDUCTORS AND BATTERY MATERIALS INCLUDING ZINC POWDERS, SILVER OXIDE POWDERS, LITHIUM-COBALT ALLOY POWDERS, AND LITHIUM-NICKEL ALLOY POWDERS;METALS, NAMELY, SILVER POWDERS FOR USE IN THE MANUFACTURE OF CONDUCTIVE PASTES, IRON POWDERS FOR USE IN MANUFACTURING VIDEOTAPES, FERRITE POWDERS FOR USE IN MANUFACTURING MAGNETS, COPPER ALLOYS FOR USE IN MANUFACTURING SPRINGS AND REED FRAMES, COPPER ALLOY WIRES, AND HIGH PURITY METALS INCLUDING GALLIUM, INDIUM, COPPER, ANTIMONY, CADMIUM, ZINC, TELLURIUM, GERMANIUM, SILVER, SELENIUM, BISMUTH AND MAGNESIUM;SILVER OXIDE POWDERS FOR USE IN MANUFACTURING DRY BATTERY OR CELL ELECTRODES;The term DOWA translates from Chinese to mean equally harmonized or joined together.;INDUSTRIAL FURNACES;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. An arrangement for measuring components has a manipulator, at least one measuring system in operative connection with the manipulator, the at least one measuring system including at least one contour measuring device associated with the manipulator and generating an optical sensing surface sweeping a measuring region, an at least one measuring object arranged in the measuring region and at least one reference feature associated with the measuring object; and a method of measurements is performed with the arrangement.