MANUFACTURING SEMICONDUCTOR DEVICES

Brand	Owner (click to sort)	Address	Description
DPIX US INSIDE	DPIX	1635 Aeroplaza Drive Colorado Springs CO 80916	Manufacturing of semiconductor devices, optical sensors, thin film transistor backplanes, electronic sensor arrays for use in medical, non-destructive testing, electronic sensor arrays for use in security type x-ray systems, and image sensors for use in X-ray apparatus for medical use for others;D PIX US INSIDE;Design of semiconductor devices, optical sensors, thin film transistor backplanes, electronic sensor arrays for use in medical, non-destructive testing, electronic sensor arrays for use in security type x-ray systems, and image sensors for use in X-ray apparatus for medical use for others;
M MINCO TECHNOLOGY LABS, INC.	MINCO TECHNOLOGY LABS, INC.	1805 Rutherford Lane Austin TX 78754	manufacturing of semiconductor devices for others;The mark consists of a representation of a semiconductor wafer board with a capitalized letter M in a forward slant superimposed on the wafer.;TECHNOLOGY LABS, INC.;
MINCO	MINCO TECHNOLOGY LABS, INC.	1805 Rutherford Lane Austin TX 78754	manufacturing of semiconductor devices for others;
US INSIDE	DPIX	1635 Aeroplaza Drive Colorado Springs CO 80916	Manufacturing of semiconductor devices, optical sensors, thin film transistor backplanes, electronic sensor arrays for use in medical, non-destructive testing, electronic sensor arrays for use in security type x-ray systems, and image sensors for use in X-ray apparatus for medical use for others;Design of semiconductor devices, optical sensors, thin film transistor backplanes, electronic sensor arrays for use in medical, non-destructive testing, electronic sensor arrays for use in security type x-ray systems, and image sensors for use in X-ray apparatus for medical use for others;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

The present disclosure relates generally to the manufacturing of semiconductor devices, and more particularly to semiconductor manufacturing using a vacuum chamber. In one example, a method for semiconductor manufacturing includes: providing a photoresist layer for a wafer; removing solvent residues from the photoresist layer by using a vacuum chamber; and exposing the wafer.