LEAD CONNECT

Brand	Owner (click to sort)	Address	Description
LEADCONNECT	Innuity, Inc.	8644 154th Avenue NE Redmond WA 98052	LEAD CONNECT;ADVERTISING AND COMMERCIAL INFORMATION SERVICES VIA THE INTERNET; DISSEMINATION OF ADVERTISING FOR OTHERS VIA THE INTERNET;PROVIDING TEMPORARY USE OF NON-DOWNLOADABLE COMPUTER SOFTWARE FOR USE BY ADVERTISERS TO PREPARE, EDIT, AND UPDATE BUSINESS PROFILE FOR DISSEMINATION TO SEARCH ENGINES; PROVIDING TEMPORARY USE OF NON-DOWNLOADABLE SOFTWARE WHICH ALLOWS CUSTOMIZED AND INDIVIDUALIZED SHARING OF BUSINESS INFORMATION AMONG SEARCH ENGINES THROUGH A WEB SITE;
LEADCONNECT	Innuity, Inc.	8644 154th Avenue NE Redmond WA 98052	LEAD CONNECT;ADVERTISING AND COMMERCIAL INFORMATION SERVICES VIA THE INTERNET; DISSEMINATION OF ADVERTISING FOR OTHERS VIA THE INTERNET;PROVIDING TEMPORARY USE OF NON-DOWNLOADABLE COMPUTER SOFTWARE FOR USE BY ADVERTISERS TO PREPARE, EDIT, AND UPDATE BUSINESS PROFILE FOR DISSEMINATION TO SEARCH ENGINES; PROVIDING TEMPORARY USE OF NON-DOWNLOADABLE SOFTWARE WHICH ALLOWS CUSTOMIZED AND INDIVIDUALIZED SHARING OF BUSINESS INFORMATION AMONG SEARCH ENGINES THROUGH A WEB SITE;
LEADCONNECT	DYL	4551 Glencoe Ave. #155 Marina Del Rey CA 90292	LEAD CONNECT;Providing on-line non-downloadable telecommunications software connecting voice over internet protocol (voIP) telephones and computers to the Internet for allowing users to make telephone calls to phone numbers stored in said computers;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

A semiconductor package includes a die that is interposed, flip-chip style, between an upper lead frame and a lower lead frame. The lower lead frame has contacts that are aligned with terminals on the bottom surface of the die. The upper lead frame contacts a terminal on the top side of the die, and the edges of the upper lead frame are bent downward around the edges of the die, giving the upper lead frame a cup shape. The edge of the upper lead frame contact another portion of the lower lead frame, so that all of the contacts of the package are coplanar and can be surface-mounted on a printed circuit board. The terminals of the die are electrically connected to the lead frames by means of solder layers. The thicknesses of the respective solder layers that connect the die to the lead frames are predetermined to optimize the performance of the package through numerous thermal cycles. This is done by fabricating the lower lead frame with a plurality of mesas and using a double solder reflow process.