LAPPING MACHINES

Brand Owner (click to sort) Address Description
814-432-3454 ABLAP INC. 226 Industrial Drive Bradford VT 05033 Lapping machines;
FAM OBARA GROUP INCORPORATED 3-2-10 Chuo-Rinkan-Annex Chuo-Rinkan, Yamato-shi Kanagawa 242-0007 Japan LAPPING MACHINES, FREE ABRASIVE MACHINES, POLISHING MACHINES, ABRADING MACHINES, GRINDING MACHINES, AND MACHINES FOR RECLAMATION OF ABRASIVE VEHICLES; AND PARTS AND FIXTURES FOR SUCH MACHINES;THE DRAWING IS LINED FOR THE COLOR RED.;
FAM OBARA GROUP INCORPORATED 3-2-10 Chuo-Rinkan-Annex Chuo-Rinkan, Yamato-shi Kanagawa 242-0007 Japan LAPPING MACHINES, FREE ABRASIVE MACHINES, POLISHING MACHINES, ABRADING MACHINES, GRINDING MACHINES, AND MACHINES FOR RECLAMATION OF ABRASIVE VEHICLE; AND PARTS AND FIXTURES FOR SUCH MACHINES;
FUJIMI FUJIMI INCORPORATED 1-1, Chiryo-2, Nishibiwajima-cho Nishikasugai-gun, Aichi-ken Japan lapping machines, polishing machines, and grinding machines, and abrasive and polishing pads, wheels and shaped solid blocks used as accessories therefor;abrasives and polishing agents in the form of powders, pastes, slurries, colloids, and pellets for use with silicon wafers, semiconductor crystals, compound semiconductors, quartz crystals, prisms, lenses, glass, metal, plastics and ceramics;The English translation of the word FUJIMI in the mark is view of Mt. Fuji.;
FUJIMITECH FUJIMI INCORPORATED 1-1, Chiryo-2, Nishibiwajima-cho Nishikasugai-gun, Aichi-ken Japan lapping machines, polishing machines, and grinding machines, and abrasive and polishing pads, wheels and shaped solid blocks used as accessories therefor;abrasives and polishing agents in the form of powders, pastes, slurries, colloids, and pellets for use with silicon wafers, semiconductor crystals, compound semiconductors, quartz crystals, prisms, lenses, glass, metal, plastics and ceramics;
HAMAI HAMAI CO., LTD. 5-5-15 Nishigotanda, Shinagawa-ku Tokyo 141-0031 Japan Lapping machines; hobbing machines; milling machines; grinding and polishing machines;
SPEEDFAM OBARA GROUP INCORPORATED 3-2-10 Chuo-Rinkan-Annex Chuo-Rinkan, Yamato-shi Kanagawa 242-0007 Japan LAPPING MACHINES, FREE ABRASIVE MACHINES, POLISHING MACHINES, ABRADING MACHINES, GRINDING MACHINES; PARTS AND FIXTURES FOR SUCH MACHINES; AND MACHINES FOR RECLAMATION OF ABRASIVE VEHICLE;
SPEEDFAM LAM RESEARCH ILLINOIS IAG, INC. 509 NORTH THIRD AVENUE DES PLAINES IL 600161196 LAPPING MACHINES, FREE ABRASIVE MACHINES, POLISHING MACHINES, ABRADING MACHINES, GRINDING MACHINES; PARTS AND FIXTURES FOR SUCH MACHINES; AND MACHINES FOR RECLAMATION OF ABRASIVE VEHICLE;
SPITFIRE PETER WOLTERS OF AMERICA, INC. 509 NORTH THIRD AVENUE DES PLAINES IL 600161196 lapping machines, free-abrasive machines, [ abrading machines ], polishing machines, grinding machines, honing machines, and parts and fittings for all the aforesaid goods;SPIT FIRE;
SPITFIRE SPEEDFAM INTERNATIONAL, INC. 305 North 54th Street Chandler AZ 852262416 lapping machines, free-abrasive machines, [ abrading machines ], polishing machines, grinding machines, honing machines, and parts and fittings for all the aforesaid goods;SPIT FIRE;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A method of fabricating a lapping carrier is provided that includes the steps of defining at least one opening extending through a workpiece that is sized to receive a wafer, and cryogenically tempering the workpiece to produce a lapping carrier. By cryogenically tempering the workpiece, the conversion of the crystalline structure of the workpiece to a martensite crystalline structure is enhanced, thereby improving the hardness of the lapping carrier. A lapping carrier is also provided that has a crystalline structure, of which at least 70% is a martensite crystalline structure. An apparatus for lapping a wafer is further provided that includes a hardened lapping carrier and at least one lapping plate proximate the lapping carrier for lapping wafer(s) disposed within the at least one opening defined by the lapping carrier.