INTEGRATED CIRCUITS MICROPROCESSORS

Brand Owner (click to sort) Address Description
1ST SOURCE - 2ND SOURCE - ALL THE MEMORY YOU NEED Hyundai Electronics America, Inc. 3101 North First Street San Jose CA 95134 Integrated circuits and microprocessors;
BUILD ON IT Hyundai Electronics America, Inc. 3101 North First Street San Jose CA 95134 Integrated circuits and microprocessors;
ECLIQX NATIONAL SEMICONDUCTOR CORPORATION 2900 Semiconductor Drive Santa Clara CA 95051 INTEGRATED CIRCUITS AND MICROPROCESSORS;
ENERGYCORE SILICON VALLEY BANK 3003 TASMAN DRIVE SANTA CLARA CA 95054 Integrated circuits and microprocessors; low power semiconductor integrated circuits and microprocessors for use with server systems and data center installations; software for programming and operating integrated circuits and microprocessors; communications software for connecting server systems, data centers, local area networks, and global computer networks; computer software for use in network management and for managing power use in computer networks, server systems, and data center installations;ENERGY CORE;
FLIPPAC Hyundai Electronics America, Inc. 3101 North First Street San Jose CA 95134 Integrated circuits and microprocessors;FLIP PACK;
M2LOGIC Hyundai Electronics America, Inc. 3101 North First Street San Jose CA 95134 integrated circuits and microprocessors;M2 LOGIC;
M2LOGIC Hyundai Electronics America, Inc. 3101 North First Street San Jose CA 95134 integrated circuits and microprocessors;M2 LOGIC;
RAMPAC Hyundai Electronics America, Inc. 3101 North First Street San Jose CA 95134 Integrated circuits and microprocessors;RAM PACK;
SMARTQUAL NATIONAL SEMICONDUCTOR CORPORATION 2900 Semiconductor Drive Santa Clara CA 95051 INTEGRATED CIRCUITS AND MICROPROCESSORS;SMART QUAL;
SPHEREON NATIONAL SEMICONDUCTOR CORPORATION 2900 Semiconductor Drive Santa Clara CA 95051 INTEGRATED CIRCUITS AND MICROPROCESSORS;
XPONAS NATIONAL SEMICONDUCTOR CORPORATION 2900 Semiconductor Drive Santa Clara CA 95051 INTEGRATED CIRCUITS AND MICROPROCESSORS;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. The invention provides a sealing layer that seals metal bonding structures between three dimensional bonded integrated circuits from a surrounding environment. A material may be applied to fill a volume between the bonded integrated circuits or seal the perimeter of the volume between the bonded integrated circuits. The material may be the same material as that used for underfilling the volume between the bottom integrated circuit and a substrate.