INTEGRATED CIRCUIT ASSEMBLIES INTERCONNECTS

Brand	Owner	Address	Description
NCF	Polymer Flip Chip Corporation	14 Fortune Drive Billerica MA 01821	Integrated Circuit Assemblies and Interconnects Therefor;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

Integrated circuit devices are provided including an integrated circuit substrate and first through fourth spaced apart lower interconnects on the integrated circuit substrate. The third and fourth spaced apart lower interconnects are parallel to the first and second lower interconnects. A first fuse is provided on the first and second lower interconnects between the first and second lower interconnects and is electrically coupled to the first and second lower interconnects. A second fuse is provided spaced apart from the first fuse and on the third and fourth lower interconnects. The second fuse is between the third and fourth lower interconnects and is electrically coupled to the third and fourth lower interconnects. Related methods of fabricating integrated circuit devices are also provided.