INTEGRATED CIRCUITS USED COMPUTER

Brand	Owner	Address	Description
AMBASSADOR	AGERE SYSTEMS INC.	Room 12L-308 1110 American Parkway NE Allentown PA 181099138	INTEGRATED CIRCUITS USED FOR COMPUTER TELEPHONY INTEGRATION BY TELEPHONE EQUIPMENT MANUFACTURERS, VALUE ADDED RESELLERS, SYSTEMS INTEGRATORS, AND COMPUTER BASED TELECOMMUNICATIONS APPLICATIONS BUILDERS;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

The invention provides a sealing layer that seals metal bonding structures between three dimensional bonded integrated circuits from a surrounding environment. A material may be applied to fill a volume between the bonded integrated circuits or seal the perimeter of the volume between the bonded integrated circuits. The material may be the same material as that used for underfilling the volume between the bottom integrated circuit and a substrate.