INTEGRATED CIRCUIT CHIPS MULTI CHIP

Brand	Owner	Address	Description
ANTENNA TO BITS	Harris Corporation	1025 West NASA Blvd. Melbourne FL 32919	integrated circuit chips and multi-chip modules for cordless phones, cellular phones, wireless terminals, and pagers;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

Techniques for fabricating multiple device components. Specifically, techniques for fabricating a stacked package comprising at least one I/C module and a multi-chip package. The multi-chip package includes a plurality of integrated circuit dices coupled to a carrier. The dice are encapsulated such that conductive elements are exposed through the encapsulant. The conductive elements are electrically coupled to the chips. The I/C module comprises an interposer having a plurality of integrated circuit dice disposed thereon. The dice of the I/C module are electrically coupled to the interposer via bondwires. The interposer is configured such that vias are aligned with the conductive elements on the multi-chip package. The multi-chip package and I/C module may be fabricated separately and subsequently coupled together to form a stacked package.