HOUSINGS INTEGRATED CIRCUITS

Brand	Owner	Address	Description
VIA/PAK	MICRO SUBSTRATES CORPORATION	2400 South Roosevelt Street Tempe AZ 85282	housings for integrated circuits;VIA PACK;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

The invention provides a sealing layer that seals metal bonding structures between three dimensional bonded integrated circuits from a surrounding environment. A material may be applied to fill a volume between the bonded integrated circuits or seal the perimeter of the volume between the bonded integrated circuits. The material may be the same material as that used for underfilling the volume between the bottom integrated circuit and a substrate.