HERMETICALLY SEALED LINEAR CIRCUIT PACKAGE

Brand Owner Address Description
ANALOG MODULE AUDIO RESEARCH CORPORATION 6655 Wedgwood Road North, Suite 115 Maple Grove MN 55311 HERMETICALLY SEALED LINEAR CIRCUIT PACKAGE FOR USE IN POWER AMPLIFIERS AND PRE-AMPLIFIERS IN AUDIO EQUIPMENT;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by one of several methods, including attachment by an electrically conductive adhesive, such as epoxy or polyimide, containing platinum metal flake in biocompatible glue; diffusion bonding of platinum bumps covered by an insulating layer; thermal welding of wire staples; or an integrated interconnect fabrication. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.