HEAT PLASTIC FILM TRANSFERS

Brand	Owner (click to sort)	Address	Description
AIRFLEX	Team Vanguard, Inc.	57 Don Knotts Blvd. Morgantown WV 265086838	heat plastic film transfers;AIR FLEX;
E-Z WEED	SPECIALTY MATERIALS & DIGITAL DECORATION	5233 South 122nd East Avenue Tulsa OK 74146	HEAT PLASTIC FILM TRANSFERS FOR MANUFACTURING PLASTIC TRANSFERS; HEAT PLASTIC FILM TRANSFERS FOR USE IN MANUFACTURING PLASTIC TRANSFERS USED FOR APPLYING LETTERS, NUMBERS, GRAPHICS OR DESIGNS ONTO GARMENTS OR OTHER SUBSTRATES;EASY WEED;WEED;
EASYWEED	SISER S.R.L.	Viale della Tecnica, 18 Vincenza 36100 Italy	heat plastic film transfers for manufacturing plastic transfers; heat plastic film transfers for use in manufacturing plastic transfers used for applying letters, numbers, graphics or designs onto garments or other substrates;EASY WEED;
SMASHON	WELLINGTON HOUSE, INC.	19520 NE San Rafael Portland OR 97230	Heat plastic film transfers for manufacturing plastic transfers; heat plastic film transfers for use in manufacturing plastic transfers used for applying letters, numbers, graphics or designs onto garments or other substrates;SMASH ON;
SPECTRUMFLEX	Edwards, Byran	169 Palisade Point Dr Ellenwood GA 30294	heat plastic film transfers for manufacturing plastic transfers; heat plastic film transfers for use in manufacturing plastic transfers used for applying letters, numbers, graphics or designs onto garments or other substrates;SPECTRUM FLEX;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

In a method of forming a polysilicon film, a thin film transistor including a polysilicon film, and a method of manufacturing a thin film transistor including a polysilicon film, the thin film transistor includes a substrate, a first heat conduction film on the substrate, a second heat conduction film adjacent to the first heat conduction film, the second heat conduction film having a lower thermal conductivity than the first heat conduction film, a polysilicon film on the second heat conduction film and the first heat conduction film adjacent to the second heat conduction film, and a gate stack on the polysilicon film. The second heat conduction film may either be on the first heat conduction film or, alternatively, the first heat conduction film may be non-contiguous and the second heat conduction film may be interposed between portions of the non-contiguous first heat conduction film.