HEAT FX

Brand Owner Address Description
HEATFX BIOCOMPATIBLES UK LIMITED One Scimed Place Maple Grove MN 55311 HEAT FX;Surgical and medical apparatus and instruments for medical use; apparatus for the treatment of cancer; cancer diagnosis apparatus; surgical, medical and medical diagnostic devices, apparatus and instruments for use in thermal ablation; medical devices for performing thermal ablation; minimally invasive surgical devices for treating cancerous and benign tissues; medical devices for delivering heat to the tip of a needle; needles; needles for use in ablation; thermal ablation needles for medical purposes; syringes; surgical probes; microwave ablation apparatus for medical purposes; medical devices and electronic medical apparatus for the analysis of tumours; medical devices and electronic medical devices for the ablation of tissues; tissue ablation apparatus for use with microwave treatments; medical apparatus consisting of treatment probes and high pressure valves used for heat treatment; integrated medical diagnostic systems that use electromagnetic sensors to provide location of medical needles in the body for medical diagnostic purposes; medical and surgical apparatus and instruments for use in supporting and positioning a bronchoscope; integrated medical treatment systems comprising medical devices and a thermal ablation unit for delivering hot temperatures to tissues for medical purposes; integrated medical treatment systems comprising medical devices and a thermal ablation unit for delivering microwaves to tissues for medical purposes; medical and surgical thermal ablation systems comprising of thermal ablation medical devices and apparatus and incorporating integrated image processing software for ablating human and animal tissue using microwave energy; parts and fittings for all the aforesaid goods;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A heat dissipation device with heat pipes is described. The heat dissipation device has at least one L-shaped heat pipe, a plurality of heat fins, and a heat sink base. One end of the L-shaped heat pipe is coupled to one heat pipe fixing trench of the heat sink base so as to increase a contact area for transmitting heat and therefore improve a heat dissipation efficiency thereof. The heat fins includes at least one upper heat fin and at least one lower heat fin to couple to the L-shaped heat pipe via a round opening and a long opening respectively. The heat dissipation device therefore reduces a volume thereof and save an occupation space in an electrical device.