FILL MORE

Brand Owner (click to sort) Address Description
FILL & MORE Volm Bag Company, Inc. 1804 N. Edison St. Antigo WI 55409 FILL AND MORE;Mesh bags for storage;
FILLMORE Medactionplan.com 87 Main Street Peapack NJ 07977 FILL MORE;Software as a service (SAAS) featuring software for use in the creation of personalized medication treatment plans for use by healthcare professionals and patients;
FILMORE Northshore Distributors, Inc. 2006 Green Court Mandeville LA 70448 FILL MORE;Cigarettes made with tobacco G 034 A 4/2/91 Cigarettes;
THE FILLMORE LIVE NATION WORLDWIDE, INC. 9348 Civic Center Drive Beverly Hills CA 90210 THE FILL MORE;Promoting a variety of live entertainment events of others; business and event management of musical, theatrical and family/variety tours and presentations; ticket agency services for musical concerts and other entertainment events through an online subscription service; retail store services featuring artist and tour-related merchandise and collectibles; promoting the goods and services of others[ through an online subscription service through which users can link to online retail services and Internet service providers; ]promoting the goods and services of others in the field of entertainmen[ through the distribution of special offers via an online subscription service, namely, promoting the entertainment packages of others through the dissemination of electronic advertisements featuring VIP privileges for the live entertainment services of others; auction services in the field of entertainment packages;] business management, business marketing and consulting services in the field of entertainment; business management in the nature of securing naming rights and sponsorship agreements for entertainment events; business development and management of entertainment events;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. An integrated circuit and a method for using metal fill geometries to reduce the voltage drop in power meshes. Metal fill geometries are connected to the power mesh using vias or wires at multiple locations. Metal fill geometries are connected to other floating metal fill geometries using vias or wires at multiple locations. The circuit design introduces maximum redundancy between metal fill geometries and power mesh geometries, but partial redundancy between metal fill geometries and metal fill geometries. In particular, the redundancy in connectivity between metal fill geometries and metal fill geometries is kept minimal to reduce the number of geometries introduced. The high redundancy between metal fill geometries and power mesh geometries and the partial redundancy among metal fill geometries result in a smaller IR-drop by reducing the effective resistance on a power mesh. Hence, the invention use redundancy carefully and advantageously to achieve simultaneous metal density and IR-drop optimization without introducing excessive number of metal fill geometries.