EQUIPMENT PERFORMING TESTING

Brand Owner (click to sort) Address Description
ASAP CREDENCE SYSTEMS CORPORATION 1421 California Circle Milpitas CA 95035 equipment for performing testing and diagnostic analysis of electronic components and assemblies such as integrated circuit die, packaged integrated circuits, hybrid circuits, and printed circuit boards;
FAULTFINDER SCHLUMBERGER TECHNOLOGIES, INC. 150 Baytech Drive San Jose CA 951342302 equipment for performing testing and diagnostic analysis of electronic components and assemblies such as integrated circuit die, packaged integrated circuits, hybrid circuits, and printed circuit boards;FAULT FINDER;
SEQUENCER PER PIN SCHLUMBERGER TECHNOLOGIES, INC. 150 Baytech Drive San Jose CA 951342302 equipment for performing testing and diagnostic analysis of electronic components and assemblies such as integrated circuit die, packaged integrated circuits, hybrid circuits, and printed circuit boards;PER PIN;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. An interface assembly (20) and method for testing a semiconductor wafer prior to performing a flip chip bumping process are provided. The interface assembly includes a flip chip bonding pad (24) having a region (28) for performing the bumping process. A test pad (22) is integrally constructed with the bonding pad and includes a probe region (26) for performing wafer-level testing prior to performing the bumping process. The integral construction of the bonding and testing pads avoids, for example, an introduction of propagation delays to test signals passing therethrough, thereby improving the accuracy and reliability of wafer test results.