EPOXY RESIN COATINGS

Brand Owner (click to sort) Address Description
DIPOXY Sascha Katzenstein Alte Langgasse 23 63457 Hanau Germany Epoxy resin coatings in the nature of paint; dyes, colorants, pigments and inks, in particular colour pigments for colouring epoxy resins;Retail and wholesale store services featuring of epoxy resin based preparations for use on wood, epoxy resins, adhesive compounds with a base of epoxy resins and colour pigments for colouring epoxy resins; Online retail and wholesale store services featuring of epoxy resin based preparations for use on wood, epoxy resins, adhesive compounds with a base of epoxy resins and colour pigments for colouring epoxy resins;Chemical substances, chemical materials and chemical preparations, and natural elements, namely, unprocessed epoxy resin based preparations for use on wood, unprocessed epoxy resin, liquid silicone for mold making and chemical additives for hardening epoxy resins; unprocessed artificial and synthetic resins, in particular epoxy resins; adhesives for general industrial use in industry, namely industrial adhesive compounds with a base of epoxy resins;
ECODYNE ECODYNE CORPORATION Chicago IL EPOXY RESIN COATINGS;
TRANS UNION TRANS UNION CORPORATION 555 West Adams Chicago IL 60661 EPOXY RESIN COATINGS;
VERSAPOX SMITH & LOVELESS, INC. 14040 Santa Fe Trail Dr. Lenexa KS 66215 EPOXY RESIN COATINGS;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. The present invention provides an epoxy resin composition for packaging a semiconductor device, characterized in having improved mold releasability during a molding process, continuous-moldability and improved solder resistance. According to the present invention, there is provided an epoxy resin composition for packaging the semiconductor element, obtained by formulating: (A) an epoxy resin; (B) a phenolic resin; (C) a curing accelerator; (D) an inorganic filler; and (E) an oxidized polyethylene wax having a drop point within a range of from 60 to 140 degree C., an acid value within a range of from 10 to 100 (mg KOH/g), a number average molecular weight within a range of from 500 to 20,000, and a mean particle size within a range of from 5 to 100 ?m, wherein at least one of (A) epoxy resin and (B) phenolic resin is a novolac structured resin having biphenylene structure, and wherein content of (E) oxidized polyethylene wax in epoxy resin composition is within a range of from 0.01 to 1 % wt.