Where the owner name is not linked, that owner no longer owns the brand
Technical Examples
The present invention include a main substrate on which electronic components are mounted; a secondary substrate wherein electronic components are mounted on a surface facing a mounting surface of the main substrate; and a shield perimeter wall formed by arranging multiple shielded substrate connectors connecting the main substrate and the secondary substrate so that an electronic circuit is surrounded. The shielded substrate connectors is formed from plugs mounted on either main or secondary substrate and sockets mounted on the other substrate, the plugs and the sockets being removably connected. The plugs and the sockets are attached to the main substrate and the secondary substrate with an attachment tool member that supports the plugs or sockets so that they are aligned with the shield perimeter wall.