ELECTRONIC FORMS FILLER SOFTWARE

Brand	Owner	Address	Description
SNAP-EE	AKEL, WILLIAM	3717 Crestview Drive Las Vegas NV 89120	electronic forms filler software for non-impact printers and personal computers;The lines in the drawing pertain to design of the mark and do not indicate color.;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

An electronic structure includes an electronic device coupled to a substrate by conductive bumps and ball limiting metallurgy (BLM). Underfill material having filler particles is disposed in a space between the electronic device and the substrate. A weight percentage of the filler particles is at least about 60%. A particle size of at least 90 wt % of the filler particles is less than about 2 ?m and/or the filler particles are coated by an organic coupling agent. Once the underfill material is fully cured, its coefficient of thermal expansion is no more than 30 PPM/Â° C., and its glass transition temperature is at least 100Â° C., and its adhesion to a passivation layer of the electronic device, to the substrate and to the electronic device at its edges is such that the electronic structure passes standardized reliability tests without delamination of the ball limiting metallurgy.