ELECTRONIC CONTROLLERS HEATING

Brand Owner (click to sort) Address Description
BONAIRE CLIMATE TECHNOLOGIES PTY LTD 26 Nylex Avenue Salisbury, SA 5108 Australia Electronic controllers for heating and cooling apparatus; solenoid valves; parts and accessories for air conditioning, heating or cooling apparatus in this class; anodes; boiler control instruments; electric cables; cathodes; central processing units; circuit breakers; conduits; data processing apparatus; electronic sensors; electric and electronic controllers; heat regulating apparatus; electric igniting apparatus; integrated circuits; electric monitoring apparatus; computer software; electric regulating apparatus; remote control apparatus; electric switches; thermostats; theft prevention installations; time switches; transformers; water level indicators;Air conditioning, heating, cooling and ventilating apparatus and installations, namely, refrigerated and evaporative cooling apparatus and installations; portable evaporative coolers; gas burners; condensers; evaporators; air dryers; fans; filters for air conditioning; flues; furnaces; heat pumps; pads for evaporative coolers; thermostatic valves; vents; central heating radiator parts and accessories for all the aforementioned goods; air diffusers; ceiling ventilators;
IRSAP IRSAP S.p.A. Via delle Industrie, 211 Arqua' Polesine (RO) Italy [ Electronic controllers for heating systems; thermostats; electrical radiators; smart thermostats; electrical resistances in the nature of electrical resistance heating wires and electrical controllers therefor; chronothermostats; electric ovens for experiments in laboratories ];Color is not claimed as a feature of the mark.;Heating radiators; sanitary apparatus and installations in the nature of floor radiators, wall-mount radiators, [ food-warmers, ] towel warmers, heated towel racks, heated towel rods, heated coat racks, heated towel dryers, radiator connectors in the nature of valves as part of radiators; [ electric towel dryers; air-conditioning apparatus in the nature of fan coils, air-handling units, water chillers, heat pumps; humidifiers; electric plate warmers; ] electric heaters for commercial use [; furnaces ];
SECTRA LENNOX INDUSTRIES INC. 2140 Lake Park Boulevard Richardson TX 75080 electronic controllers for heating, ventilating and air conditioning systems;
VIRON FLUIDRA COMMERCIAL, S.A.U. Av. Francesc Macià, 60, planta 20 E-08208 Sabadell (Barcelona) Spain electronic controllers for the heating, refrigeration and supply of water; electronic controllers for operating wellness centers and swimming pools, heating, air supply, chlorination, saline chlorination; electronic controllers for lighting, underwater lighting, fiber-optic lighting;electric pumps for use in swimming pools, spas, whirpools and baths; electrical water pumps for swimming pools, spas, baths, whirpools; automatic swimming pool cleaners and parts therefor; manually operated metal valves;air and water heating and cooling apparatus, namely, water heaters, water cooling towers, air cooling apparatus, and heat pumps; filters for spas, baths, whirlpools and swimming pools, heaters, heat exchangers, chlorination apparatus, saline chlorination apparatus; sand filters for water; heat pumps; regulating accessories for water and gas supply, namely, metered valves; heaters, namely, electric water heaters, gas water heaters; gas stoves; electric water heaters; heat exchangers not being parts of machines; combination water heater and pump; hydronic water heaters, radiators; apparatus for lighting being lighting fixtures, LED underwater lights, fiber-optic lighting fixtures used in conjunction with electrical illuminators;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A method and electrical structure for separating electronic components from one another joined by solder interconnections. An electronic module is joined to a substrate via a solder interconnection, whereby the electronic module has an electrical heating component residing within a bottom layer thereof adjacent a solder interconnection. Preferably, a chip carrier is joined to a board whereby the chip carrier has an electrical mesh plane for heating adjacent the solder interconnection. Resistive heat is generated within this electrical heating component either by applying an electrical current to the electrical heating component, or by non-contact inductively heating the layer in which such electrical heating component resides to generate resistive heat within the electrical heating component. The resistive heat is transferred to the solder interconnection to allow for localized melting of the solder interconnection and removal of the electronic components from one another.