ELECTRICAL SNAP ACTION SWITCHES

Brand Owner (click to sort) Address Description
CHERRY CHERRY EUROPE GMBH Cherrystrasse 2 91275 Auerbach/Opf. Germany ELECTRICAL SNAP-ACTION SWITCHES;
CHERRY CHERRY GMBH CHERRYSTRASSE AUERBACH/OPF D-91275 Germany ELECTRICAL SNAP-ACTION SWITCHES;
CHERRY ZF ELECTRONICS CORPORATION 10411 CORPORATE DRIVE, SUITE 102 PLEASANT PRAIRIE WI 53158 ELECTRICAL SNAP-ACTION SWITCHES;
CHERRY CHERRY CORPORATION 10411 CORPORATE DRIVE, SUITE 102 PLEASANT PRAIRIE WI 53158 ELECTRICAL SNAP-ACTION SWITCHES;
ROCK WIPE CHERRY ELECTRICAL PRODUCTS CORPORATION 1650 DEERFIELD ROAD HIGHLAND PARK IL ELECTRICAL SNAP-ACTION SWITCHES;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A heat sink is arranged on a main circuit board of an electronic module. The heat sink includes a three-dimensionally structured thermally conductive plate with a press-on region and with snap-action hooks. The snap-action hooks are arranged approximately at right angles with respect to the press-on region and are resiliently connected to the press-on region. The snap-action hooks are latched into place, with pressure generation of the press-on region onto a rear side of a surface-mountable semiconductor device, into corresponding passage openings of the circuit board. A plastically deformable thermal composition is disposed between the rear side of the semiconductor device and the press-on region of the heat sink so as to form an intermediate layer therebetween to provide compensation for the thickness tolerances of the semiconductor device.