ELECTRICAL ELECTRONIC COMPONENT

Brand Owner (click to sort) Address Description
POLY-FUSE Wickmann-Werke GmbH c/o Littelfuse 800 E. Northwest Highway Des Plaines IL 60016 electrical and electronic component, namely circuit protection fuses, miniature fuses, thin film fuses, thermal fuses and temperature switches for over-temperature protection, telecommunication fuses; gas discharge arresters; varistors and voltage dependent resistors for over-voltage protection; thermistors; low voltage fuse-links, high performance semiconductor fuse-links; high-voltage fuses and holders; valve-type lightning arrestors, namely low-voltage lightning arresters and medium-voltage lightning arresters; printed circuits equipped with electronical and electronic components; integrated circuits; holders, caps and housings which are especially adapted to the afore-mentioned components;POLY FUSE;POLY FUSE;
QUICKMOUNT MONSTER 7251 Lake Mead Blvd, West, 3rd Floor Las Vegas NV 89128 Electrical and electronic component and speaker hardware, namely, bracket for the mounting of an entertainment power strip;QUICK MOUNT;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A method and electrical structure for separating electronic components from one another joined by solder interconnections. An electronic module is joined to a substrate via a solder interconnection, whereby the electronic module has an electrical heating component residing within a bottom layer thereof adjacent a solder interconnection. Preferably, a chip carrier is joined to a board whereby the chip carrier has an electrical mesh plane for heating adjacent the solder interconnection. Resistive heat is generated within this electrical heating component either by applying an electrical current to the electrical heating component, or by non-contact inductively heating the layer in which such electrical heating component resides to generate resistive heat within the electrical heating component. The resistive heat is transferred to the solder interconnection to allow for localized melting of the solder interconnection and removal of the electronic components from one another.