ELECTRIC SENSOR PADS RECEIVING

Brand Owner (click to sort) Address Description
SLEEPRA HAPTIC, INC. 5402 Chevy Circle Austin TX 78723 Electric sensor pads for receiving, processing, and transmitting information relating to sleep and gesture-activated functions; silent wake alarms in the nature of vibrating alarms; multifunctional electronic devices for sensing, detecting, measuring, interpreting, and transmitting information from a bed's surface including time, date, heart rate, breathing, snoring, state of sleep, sleeping position, activity level, and deliberate movements or gestures, and a silent wake alarm; computer software for data communication with sensor pads or silent wake alarms for receiving, processing, transmitting, and displaying information relating to sleep, alarms, or gesture-activated functions;
SLEEPRA Swan Solutions, Inc. 5542 Valkeith Dr. Houston TX 77096 Electric sensor pads for receiving, processing, and transmitting information relating to sleep and gesture-activated functions; silent wake alarms in the nature of vibrating alarms; multifunctional electronic devices for sensing, detecting, measuring, interpreting, and transmitting information from a bed's surface including time, date, heart rate, breathing, snoring, state of sleep, sleeping position, activity level, and deliberate movements or gestures, and a silent wake alarm; computer software for data communication with sensor pads or silent wake alarms for receiving, processing, transmitting, and displaying information relating to sleep, alarms, or gesture-activated functions;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. One embodiment of the present invention provides a system that facilitates capacitive inter-chip communication. During operation, the system first determines an alignment between a first semiconductor die and a second semiconductor die. Next, electrical signals are selectively routed to at least one interconnect pad in a plurality of interconnect pads based on the alignment thereby facilitating communication between the first semiconductor die and the second semiconductor die. The plurality of interconnect pads can include transmitting pads, receiving pads, and transmitting and receiving pads. The alignment may be determined continuously or at times separated by an interval, where the interval is fixed or variable. Several variations on this embodiment are provided.