DIES USE CUTTING

Brand Owner (click to sort) Address Description
BLOCK ON BOARD ACCUQUILT 8843 South 137th Circle Omaha NE 68138 Dies for use in cutting machines;BLOCK;
BOB ACCUQUILT 8843 South 137th Circle Omaha NE 68138 Dies for use in cutting machines;
BULLSEYE TEK INDUSTRIES Suite 200 11801 Pierce Street Riverside CA 92505 Dies for use in cutting machines;
ZIP'ECUTS C.A.D. Design 876 North 1430 West Orem UT 84057 Dies for use in cutting shapes, letters and numbers from paper;ZIP' E CUTS;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A pre-process before cutting a wafer is described. The wafer includes a plurality of scribe lines and a plurality of dies defined by the scribe lines, and a material layer covers the wafer. A pre-processing step is performed to remove the material layer on the scribe lines close to the corner regions of the dies. Removing the material layer at the corner regions before cutting the wafer is able to preserve the integrity of the corner regions of the cut dies.