DEVICES PACKAGING INDUSTRY

Brand	Owner (click to sort)	Address	Description
MSK COVERTECH	MSK-VERPACKUNGS-SYSTEME GESELLSCHAFT MITBESCHRANKTER HAFTUNG	Benzstrasse Kleve 47533 Germany	devices for the packaging industry, particularly for processing packaging or wrapping foil, namely, foil and shrink wrapping machines; pallet handling machines for packaging and foil wrapping, transporters for palletized and non-palletized goods to be wrapped, foil tensioning machines;The mark is lined for the color orange.;
STARLIGHT	MSK-VERPACKUNGS-SYSTEME GESELLSCHAFT MITBESCHRANKTER HAFTUNG	Benzstrasse Kleve 47533 Germany	devices for the packaging industry, particularly for processing packaging or wrapping foil, namely, foil and shrink wrapping machines, pallet handling machines for packaging and foil wrapping, transporters for palletized and non-palletized goods to be wrapped, foil tensioning machines;STAR LIGHT;
STARLIGHT	MSK-VERPACKUNGS-SYSTEME GESELLSCHAFT MIT BESCHRANKTER HAFTUNG	Benzstraße Kleve 47533 Germany	devices for the packaging industry, particularly for processing packaging or wrapping foil, namely, foil and shrink wrapping machines, pallet handling machines for packaging and foil wrapping, transporters for palletized and non-palletized goods to be wrapped, foil tensioning machines;STAR LIGHT;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

Packaging assemblies for optically interactive devices and methods of forming the packaging assemblies in an efficient manner that eliminates or reduces the occurrence of process contaminants. In a first embodiment, a transparent cover is attached to a wafer of semiconductor material containing a plurality of optically interactive devices. The wafer is singulated, and the optically interactive devices are mounted on an interposer and electrically connected with wire bonds. In a second embodiment, the optically interactive devices are electrically connected to the interposer with back side conductive elements. In a third embodiment, the optically interactive devices are mounted to the interposer prior to attaching a transparent cover. A layer of encapsulant material is formed over the interposer, and the interposer and encapsulant material are cut to provide individual packaging assemblies. In a fourth embodiment, the optically interactive devices are mounted in a preformed leadless chip carrier.