DATA PROCESSING PACKAGE BE

Brand	Owner (click to sort)	Address	Description
TOP I/O	TOPTOOLS	TOUR GENERALE 5 PLACE DE LA PYRAMIDE, QUARTIER VILLON PARIS LA DEFENSE France	data processing package to be used on computers to generate business oriented applications organized around a data base;
TOPWAY	TOPTOOLS	TOUR GENERALE 5 PLACE DE LA PYRAMIDE, QUARTIER VILLON PARIS LA DEFENSE France	data processing package to be used on computers to generate business oriented applications organized around a data base;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

To decrease the thickness, or stack height, of an electronics package, the package includes a solderless compression connector between an integrated circuit (IC) package and a substrate such as a printed circuit board (PCB). In one embodiment, the IC package is mounted on the substrate using a land grid array arrangement. Corresponding lands on the IC package and substrate are coupled using a solderless compression connector. The compression connector includes a plurality of electrically conductive particles, and a thin, flexible apertured support that aligns the particles with corresponding lands on the IC package and substrate. A compression connector may also be used to electrically couple an IC to an IC package substrate. Methods of fabrication, as well as application of the package to an electronic assembly, an electronic system, and a data processing system, are also described.