CUSTOMIZED MICROELECTRONIC PRODUCTS SYSTEMS

Brand Owner (click to sort) Address Description
SECURITY TO THE SILICON Terepac Corporation 554 Parkside Drive Waterloo, Ontario N2L5Z4 Canada Customized microelectronic products and systems, namely, hardware, firmware, software, namely, wireless sensors, and miniaturized electronic products, namely, condition sensing electronics for use in the following fields including but not limited to: product packaging, agriculture, biological, medical, food traceability, real time location systems, machine sensing, secure documents, digital currency, personal area network, smart homes, wearable sensors, remote monitoring, and embedded intelligence, municipal water systems, marine monitoring systems, automotive, mining, oil and gas and retail outlets;SECURITY;Custom manufacture and assembly of electronic products, namely, RFID tags, wireless sensors, blank smart cards and other miniaturized electronic products, namely, miniaturized microprocessors and signal-conditioning electronics;
TERETAG Terepac Corporation 554 Parkside Drive Waterloo, Ontario N2L5Z4 Canada customized microelectronic products and systems, namely, RFID tags, wireless sensors, blank smart cards and other miniaturized electronic products, namely, miniaturized microprocessors, signal-conditioning electronic devices for use in the fields of product packaging, agriculture, biological, medical, food traceability, real time location systems, secure documents, digital currency, personal area network, smart homes, wearable sensors, remote monitoring, and embedded intelligence; and electronic actuators;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A method and apparatus for removing conductive material from a microelectronic substrate. In one embodiment, a support member supports a microelectronic substrate relative to a material removal medium, which can include first and second electrodes and a polishing pad. One or more electrolytes are disposed between the electrodes and the microelectronic substrate to electrically link the electrodes to the microelectronic substrate. The electrodes are then coupled to a source of varying current that electrically removes the conductive material from the substrate. The microelectronic substrate and/or the electrodes can be moved relative to each other to position the electrodes relative to a selected portion of the microelectronic substrate, and/or to polish the microelectronic substrate. The material removal medium can remove gas formed during the process from the microelectronic substrate and/or the electrodes. The medium can also have different first and second electrical characteristics to provide different levels of electrical coupling to different regions of the microelectronic substrate.