CUSTOMIZED MATERIALS ASSEMBLY OTHERS

Brand Owner (click to sort) Address Description
LEADING THE PACK CREE, INC. 4600 Silicon Drive Durham NC 27703 Customized materials assembly for others; manufacture of radio frequency in microwave devices and components, namely, packaged monolithic microwave integrated circuits (MMIC), packaged discrete transistors, MMIC bare die; discrete broadband die, discrete bare die for others; manufacture of transistors for others; manufacture of wireless communication components removing typographical error ; manufacture of amplifiers for others; manufacture of lateral diffused metal oxide semiconductors (LDMOS) for others; manufacture of metal semiconductor field effect transistors (MESFETS) for others; manufacture of components formatted for the worldwide interoperability for microwave access standard for others; manufacturing services for others in the field of semiconductor devices; providing semiconductor material treatment information; technical support services, namely, providing technical advice related to the manufacture of semiconductor materials and devices;Integrated circuit chips; microwave generating devices for industrial use, namely, microwave integrated circuits; transistors; diodes; semiconductor devices; semiconductor chips; semiconductor wafers, namely, silicon semiconductor wafers, silicon carbide semiconductor wafers, and gallium nitride semiconductor wafers; radio frequency (RF) devices, namely, packaged monolithic microwave integrated circuits (MMIC), packaged discrete transistors, semiconductor devices in the nature of MMIC bare die, discrete broadband die, and discrete bare die; power transistor switching devices; power supplies; electric switches, electric controllers; electric circuitry, namely, electric circuits, electric circuit closers, electric circuit openers, electric circuit switches; power modules;Testing of semiconductor materials and devices, namely, silicon carbide and/or gallium nitride power and wireless systems; technical project research of semiconductor materials and devices, namely, silicon carbide and/or gallium nitride power and wireless systems; research and development of semiconductor materials and devices, namely, silicon carbide and/or gallium nitride power and wireless systems for others; engineering service in the field of semiconductor materials and devices, namely, silicon carbide and/or gallium nitride power and wireless systems; design of radio frequency and microwave devices and components in the nature of packaged monolithic microwave integrated circuits (MMIC), packaged discrete transistors, MMIC bare die, discrete broadband die, discrete bare die for others, transistors, wireless communication components, amplifiers, lateral diffused metal oxide semiconductors (LDMOS), metal semiconductor field effect transistors (MESFETS), and components formatted for the worldwide interoperability for microwave access standard; packaging design; contract foundry design, testing and engineering support services in the field of semiconductor materials and devices;
LEADING THE PACK CREE, INC. 4600 Silicon Drive Durham NC 27703 Customized materials assembly for others; manufacture of radio frequency in microwave devices and components, namely, packaged monolithic microwave integrated circuits (MMIC), packaged discrete transistors, MMIC bare die; discrete broadband die, discrete bare die for others; manufacture of transistors for others; manufacture of wireless communication components removing typographical error ; manufacture of amplifiers for others; manufacture of lateral diffused metal oxide semiconductors (LDMOS) for others; manufacture of metal semiconductor field effect transistors (MESFETS) for others; manufacture of components formatted for the worldwide interoperability for microwave access standard for others; manufacturing services for others in the field of semiconductor devices; providing semiconductor material treatment information; technical support services, namely, providing technical advice related to the manufacture of semiconductor materials and devices;The mark consists of a stylized drawing of a wolf's head over the words LEADING THE PACK.;Integrated circuit chips; microwave generating devices for industrial use, namely, microwave integrated circuits; transistors; diodes; semiconductor devices; semiconductor chips; semiconductor wafers, namely, silicon semiconductor wafers, silicon carbide semiconductor wafers, and gallium nitride semiconductor wafers; radio frequency (RF) devices, namely, packaged monolithic microwave integrated circuits (MMIC), packaged discrete transistors, semiconductor devices in the nature of MMIC bare die, discrete broadband die, and discrete bare die; power transistor switching devices; power supplies; electric switches, electric controllers; electric circuitry, namely, electric circuits, electric circuit closers, electric circuit openers, electric circuit switches; power modules;Color is not claimed as a feature of the mark.;Testing of semiconductor materials and devices, namely, silicon carbide and/or gallium nitride power and wireless systems; technical project research of semiconductor materials and devices, namely, silicon carbide and/or gallium nitride power and wireless systems; research and development of semiconductor materials and devices, namely, silicon carbide and/or gallium nitride power and wireless systems for others; engineering service in the field of semiconductor materials and devices, namely, silicon carbide and/or gallium nitride power and wireless systems; design of radio frequency and microwave devices and components in the nature of packaged monolithic microwave integrated circuits (MMIC), packaged discrete transistors, MMIC bare die, discrete broadband die, discrete bare die for others, transistors, wireless communication components, amplifiers, lateral diffused metal oxide semiconductors (LDMOS), metal semiconductor field effect transistors (MESFETS), and components formatted for the worldwide interoperability for microwave access standard; packaging design; contract foundry design, testing and engineering support services in the field of semiconductor materials and devices;
LEADING THE PACK WOLFSPEED, INC. 4600 Silicon Drive Durham NC 27703 Customized materials assembly for others; manufacture of radio frequency in microwave devices and components, namely, packaged monolithic microwave integrated circuits (MMIC), packaged discrete transistors, MMIC bare die, discrete broadband die, discrete bare die for others; manufacture of transistors for others; manufacture of wireless communication components; manufacture of amplifiers for others; manufacture of lateral diffused metal oxide semiconductors (LDMOS) for others; manufacture of metal semiconductor field effect transistors (MESFETS) for others; manufacture of components formatted for the worldwide interoperability for microwave access standard for others; manufacturing services for others in the field of semiconductor devices; providing semiconductor material treatment information; technical support services, namely, providing technical advice related to the manufacture of semiconductor materials and devices;Integrated circuit chips; microwave generating devices for industrial use, namely, microwave integrated circuits; transistors; diodes; semiconductor devices; semiconductor chips; semiconductor wafers, namely, silicon semiconductor wafers, silicon carbide semiconductor wafers, and gallium nitride semiconductor wafers; radio frequency (RF) devices, namely, packaged monolithic microwave integrated circuits (MMIC), packaged discrete transistors, semiconductor devices in the nature of MMIC bare die, discrete broadband die, and discrete bare die; power transistor switching devices; power supplies; electric switches, electric controllers; electric circuitry, namely, electric circuits, electric circuit closers, electric circuit openers, electric circuit switches, and power modules;Testing of semiconductor materials and devices, namely, silicon carbide and gallium nitride power and wireless systems; technical project research of semiconductor materials and devices, namely, silicon carbide and gallium nitride power and wireless systems; research and development of semiconductor materials and devices, namely, silicon carbide and gallium nitride power and wireless systems for others; engineering service in the field of semiconductor materials and devices, namely, silicon carbide and gallium nitride power and wireless systems; design of radio frequency and microwave devices and components in the nature of packaged monolithic microwave integrated circuits (MMIC), packaged discrete transistors, MMIC bare die, discrete broadband die, discrete bare die for others, transistors, wireless communication components, amplifiers, lateral diffused metal oxide semiconductors (LDMOS), metal semiconductor field effect transistors (MESFETS), and components formatted for the worldwide interoperability for microwave access standard; packaging design; contract foundry design, testing and engineering support services in the field of semiconductor materials and devices;
UNLEASHING THE POWER OF POSSIBILITIES WOLFSPEED, INC. 4600 Silicon Drive Durham NC 27703 Customized materials assembly for others; material processing information; metal processing; manufacture of radio frequency in microwave devices and components, namely, packaged monolithic microwave integrated circuits (MMIC), packaged discrete transistors, MMIC bare die, discrete broadband die, discrete bare die for others; manufacture of transistors for others; manufacture of wireless communication components for others; manufacture of amplifiers for others; manufacture of lateral diffused metal oxide semiconductors (LDMOS) for others; manufacture of metal semiconductor field effect transistors (MESFETS) for others; manufacture of components formatted for the worldwide interoperability for microwave access (WiMax) standard for others; manufacturing services for others in the field of semiconductor devices; providing semiconductor material treatment information; technical support services, namely, providing technical advice related to the manufacture of semiconductor materials and devices;Electric converters; DC/DC power converters; DC/AC power converters; battery chargers; renewable battery system to provide backup power; wireless chargers; inverters; power inverters; solar inverters; batteries, namely, batteries for electric vehicles; charging stations for charging electric vehicles; semiconductor materials and devices, namely, silicon carbide and gallium nitride power and wireless systems; gallium nitride field effect transistors for tactical collision avoidance system; metal oxide semiconductor field effect transistors; lateral diffused metal oxide semiconductors; electric circuit boards; radar machines and apparatus; radar machines and apparatus for weather, navigation and air traffic control; radio receivers and transmitters; wireless transreceiver radios; satellite processors; satellite transmitters and receivers; high-electron mobility transistors; radio pagers; radio beacons; distance measuring apparatus; satellite navigational apparatus; navigational instruments; amplifiers; power amplifiers; MMIC power amplifiers; RF power amplifiers; electronic transmitters for jamming signals; radar jamming apparatus; power supplies, electrical; voltage stabilizing power supply; high-frequency switching power supplies; high-voltage power supplies; low-voltage power supplies; electronic power supplies for electric motors; telecommunications exchangers; telecommunications cables; telecommunication transmitters; electric capacitors for telecommunication apparatus; electric resistors for telecommunications apparatus; solar panels for the production of electricity; Chips; microwave generating devices for industrial use; transistors; diodes; semiconductor devices; semiconductor chips; semiconductor wafers; radio frequency (rf) devices; power switching devices; power supplies; semiconductor wafers, materials and devices composed of silicon carbide and gallium nitride; electric switches, electric controllers; electric circuitry, namely, electric circuits, electric circuit closers, electric circuit openers, electric circuit switches; electronic devices, namely, semiconductor rectifying and schottky diodes for high power applications and low switching loss; power modules; power conversion systems;Testing of semiconductor materials and devices, namely, silicon carbide and gallium nitride power and wireless systems; technical project research of semiconductor materials and devices, namely, silicon carbide and gallium nitride power and wireless systems; research and development of semiconductor materials and devices, namely, silicon carbide and gallium nitride power and wireless systems for others; engineering service in the field of semiconductor materials and devices, namely, silicon carbide and gallium nitride power and wireless systems; design of radio frequency and microwave devices and components in the nature of packaged monolithic microwave integrated circuits (MMIC), packaged discreet transistors, MMIC bare die, discrete broadband die, discrete bare die for others, transistors, wireless communication components, amplifiers, lateral diffused metal oxide semiconductors (LDMOS), metal semiconductor field effect transistors (MESFETS), and components formatted for the worldwide interoperability for microwave access standard; packaging design; contract foundry design, testing and engineering support services in the field of semiconductor materials and devices;
WOLFSPEED WOLFSPEED, INC. 4600 Silicon Drive Durham NC 27703 Customized materials assembly for others; manufacture of radio frequency in microwave devices and components, monolithic microwave integrated circuits (MMIC) bare die; discrete broadband die, discrete bare die for others; manufacture of transistors for others; manufacture of wireless communication components; manufacture of amplifiers for others; manufacture of components formatted for the worldwide interoperability for microwave access standard for others; manufacturing services for others in the field of semiconductor devices; providing semiconductor material treatment information; technical support services, namely, providing technical advice related to the manufacture of semiconductor materials and devices;The mark consists of a stylized drawing of a wolf's head over the word WOLFSPEED.;Integrated circuit chips; microwave generating devices for industrial use, namely, microwave integrated circuits; transistors; diodes; semiconductor devices; semiconductor chips; semiconductor wafers, namely, silicon carbide semiconductor wafers, radio frequency (RF) devices, namely, packaged monolithic microwave integrated circuits (MMIC), packaged discrete transistors, semiconductor devices in the nature of MMIC bare die, discrete broadband die, and discrete bare die; power transistor switching devices; electric switches, electric controllers; electric circuitry, namely, electric circuits, electric circuit closers, electric circuit openers, and power modules;Color is not claimed as a feature of the mark.;Testing of semiconductor materials and devices, namely, silicon carbide and/or gallium nitride power and wireless systems; technical project research of semiconductor materials and devices, namely, silicon carbide and/or gallium nitride power and wireless systems; research and development of semiconductor materials and devices, namely, silicon carbide and/or gallium nitride power and wireless systems for others; engineering service in the field of semiconductor materials and devices, namely, silicon carbide and/or gallium nitride power and wireless systems; design of radio frequency and microwave devices and components in the nature of monolithic microwave integrated circuits (MMIC) bare die, discrete broadband die, discrete bare die for others, transistors, wireless communication components, amplifiers, lateral diffused metal oxide semiconductors (LDMOS), and components formatted for the worldwide interoperability for microwave access standard; packaging design; contract foundry design, testing and engineering support services in the field of semiconductor materials and devices;
WOLFSPEED WOLFSPEED, INC. 4600 Silicon Drive Durham NC 27703 Customized materials assembly for others; manufacture of radio frequency in microwave devices and components, monolithic microwave integrated circuits (MMIC) bare die; discrete broadband die, discrete bare die for others; manufacture of transistors for others; manufacture of wireless communication components; manufacture of amplifiers for others; manufacture of components formatted for the worldwide interoperability for microwave access standard for others; manufacturing services for others in the field of semiconductor devices; providing semiconductor material treatment information; technical support services, namely, providing technical advice related to the manufacture of semiconductor materials and devices;Integrated circuit chips; microwave generating devices for industrial use, namely, microwave integrated circuits; transistors; diodes; semiconductor devices; semiconductor chips; semiconductor wafers, namely, silicon carbide semiconductor wafers, radio frequency (RF) devices, namely, packaged monolithic microwave integrated circuits (MMIC), packaged discrete transistors, semiconductor devices in the nature of MMIC bare die, discrete broadband die, and discrete bare die; power transistor switching devices; electric switches, electric controllers; electric circuitry, namely, electric circuits, electric circuit closers, electric circuit openers, and power modules;Testing of semiconductor materials and devices, namely, silicon carbide and/or gallium nitride power and wireless systems; technical project research of semiconductor materials and devices, namely, silicon carbide and/or gallium nitride power and wireless systems; research and development of semiconductor materials and devices, namely, silicon carbide and/or gallium nitride power and wireless systems for others; engineering service in the field of semiconductor materials and devices, namely, silicon carbide and/or gallium nitride power and wireless systems; design of radio frequency and microwave devices and components in the nature of packaged monolithic microwave integrated circuits (MMIC), packaged discrete transistors, MMIC bare die, discrete broadband die, discrete bare die for others, transistors, wireless communication components, amplifiers, lateral diffused metal oxide semiconductors (LDMOS), metal semiconductor field effect transistors (MESFETS), and components formatted for the worldwide interoperability for microwave access standard; packaging design; contract foundry design, testing and engineering support services in the field of semiconductor materials and devices;
WOLFSPEED WOLFSPEED, INC. 4600 Silicon Drive Durham NC 27703 Customized materials assembly for others; material processing information; metal processing; manufacture of radio frequency in microwave devices and components, namely, packaged monolithic microwave integrated circuits (MMIC), packaged discrete transistors, MMIC bare die, discrete broadband die, discrete bare die for others; manufacture of transistors for others; manufacture of wireless communication components for others; manufacture of amplifiers for others; manufacture of lateral diffused metal oxide semiconductors (LDMOS) for others; manufacture of metal semiconductor field effect transistors (MESFETS) for others; manufacture of components formatted for the worldwide interoperability for microwave access (WiMax) standard for others; manufacturing services for others in the field of semiconductor devices; providing semiconductor material treatment information; technical support services, namely, providing technical advice related to the manufacture of semiconductor materials and devices;The mark consists of a stylized drawing of a wolf's head over the word WOLFSPEED.;Electric converters; DC/DC power converters; DC/AC power converters; battery chargers; renewable battery system to provide backup power; wireless chargers; inverters; power inverters; solar inverters; batteries, namely, batteries for electric vehicles; charging stations for charging electric vehicles; semiconductor materials and devices, namely, silicon carbide and gallium nitride power and wireless systems; gallium nitride field effect transistors for tactical collision avoidance system; metal oxide semiconductor field effect transistors; lateral diffused metal oxide semiconductors; electric circuit boards; radar machines and apparatus; radar machines and apparatus for weather, navigation and air traffic control; radio receivers and transmitters; wireless transreceiver radios; satellite processors; satellite transmitters and receivers; high-electron mobility transistors; radio pagers; radio beacons; distance measuring apparatus; satellite navigational apparatus; navigational instruments; amplifiers; power amplifiers; MMIC power amplifiers; RF power amplifiers; electronic transmitters for jamming signals; radar jamming apparatus; power supplies, electrical; voltage stabilizing power supply; high-frequency switching power supplies; high-voltage power supplies; low-voltage power supplies; electronic power supplies for electric motors; telecommunications exchangers; telecommunications cables; telecommunication transmitters; electric capacitors for telecommunication apparatus; electric resistors for telecommunications apparatus; solar panels for the production of electricity; Chips; microwave generating devices for industrial use; transistors; diodes; semiconductor devices; semiconductor chips; semiconductor wafers; radio frequency (rf) devices; power switching devices; power supplies; semiconductor wafers, materials and devices composed of silicon carbide and gallium nitride; electric switches, electric controllers; electric circuitry, namely, electric circuits, electric circuit closers, electric circuit openers, electric circuit switches; electronic devices, namely, semiconductor rectifying and schottky diodes for high power applications and low switching loss; Power modules; power conversion systems;WOLF SPEED;Color is not claimed as a feature of the mark.;Testing of semiconductor materials and devices, namely, silicon carbide and gallium nitride power and wireless systems; technical project research of semiconductor materials and devices, namely, silicon carbide and gallium nitride power and wireless systems; research and development of semiconductor materials and devices, namely, silicon carbide and gallium nitride power and wireless systems for others; engineering service in the field of semiconductor materials and devices, namely, silicon carbide and gallium nitride power and wireless systems; design of radio frequency and microwave devices and components in the nature of packaged monolithic microwave integrated circuits (MMIC), packaged discreet transistors, MMIC bare die, discrete broadband die, discrete bare die for others, transistors, wireless communication components, amplifiers, lateral diffused metal oxide semiconductors (LDMOS), metal semiconductor field effect transistors (MESFETS), and components formatted for the worldwide interoperability for microwave access standard; packaging design; contract foundry design, testing and engineering support services in the field of semiconductor materials and devices;
WOLFSPEED LEADING THE PACK CREE, INC. 4600 Silicon Drive Durham NC 27703 Customized materials assembly for others; manufacture of radio frequency in microwave devices and components, namely, packaged monolithic microwave integrated circuits (MMIC), packaged discrete transistors, MMIC bare die; discrete broadband die, discrete bare die for others; manufacture of transistors for others; manufacture of wireless communication components removing typographical error ; manufacture of amplifiers for others; manufacture of lateral diffused metal oxide semiconductors (LDMOS) for others; manufacture of metal semiconductor field effect transistors (MESFETS) for others; manufacture of components formatted for the worldwide interoperability for microwave access standard for others; manufacturing services for others in the field of semiconductor devices; providing semiconductor material treatment information; technical support services, namely, providing technical advice related to the manufacture of semiconductor materials and devices;The mark consists of a stylized drawing of a wolf's head over the word WOLFSPEED, which is over the words LEADING THE PACK.;Integrated circuit chips; microwave generating devices for industrial use, namely, microwave integrated circuits; transistors; diodes; semiconductor devices; semiconductor chips; semiconductor wafers, namely, silicon semiconductor wafers, silicon carbide semiconductor wafers, and gallium nitride semiconductor wafers; radio frequency (RF) devices, namely, packaged monolithic microwave integrated circuits (MMIC), packaged discrete transistors, semiconductor devices in the nature of MMIC bare die, discrete broadband die, and discrete bare die; power transistor switching devices; power supplies; electric switches, electric controllers; electric circuitry, namely, electric circuits, electric circuit closers, electric circuit openers, electric circuit switches; power modules;WOLF SPEED LEADING THE PACK;Color is not claimed as a feature of the mark.;Testing of semiconductor materials and devices, namely, silicon carbide and/or gallium nitride power and wireless systems; technical project research of semiconductor materials and devices, namely, silicon carbide and/or gallium nitride power and wireless systems; research and development of semiconductor materials and devices, namely, silicon carbide and/or gallium nitride power and wireless systems for others; engineering service in the field of semiconductor materials and devices, namely, silicon carbide and/or gallium nitride power and wireless systems; design of radio frequency and microwave devices and components in the nature of packaged monolithic microwave integrated circuits (MMIC), packaged discrete transistors, MMIC bare die, discrete broadband die, discrete bare die for others, transistors, wireless communication components, amplifiers, lateral diffused metal oxide semiconductors (LDMOS), metal semiconductor field effect transistors (MESFETS), and components formatted for the worldwide interoperability for microwave access standard; packaging design; contract foundry design, testing and engineering support services in the field of semiconductor materials and devices;
 

Where the owner name is not linked, that owner no longer owns the brand

   
Technical Examples
  1. A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.