CUSTOM MANUFACTURING FABRICATION EQUIPMENT

Brand Owner Address Description
APPLIED EPI Applied Epi, Inc. 4900 Constellation Drive St. Paul MN 55127 CUSTOM MANUFACTURING OF FABRICATION EQUIPMENT AND RELATED COMPONENTS IN THE NATURE OF EFFUSION CELLS, VALVED CRACKERS AND ELECTRONIC GROWTH REACTOR SYSTEMS USED IN THE PRODUCTION OF SEMICONDUCTORS USED IN COMMUNICATION DEVICES IN THE NATURE OF CELLULAR PHONES, PERSONAL DIGITAL ASSISTANTS, PAGERS, SOLID STATE LASER PUMPS AND OTHER COMMUNICATION DEVICES USING DIRECT SATELLITE OR OPTICAL FIBER TECHNOLOGY;FABRICATION EQUIPMENT AND RELATED COMPONENTS USED IN THE FABRICATION OF SEMICONDUCTORS, NAMELY, EFFUSION CELLS, VALVED CRACKERS, ELECTRONIC REACTORS FOR GROWING CRYSTALLINE SUBSTRATES, AND SOFTWARE, ALL USED IN THE PRODUCTION OF SEMICONDUCTORS THROUGH MOLECULAR BEAM EPITAXY AND CHEMICAL VAPOR DEPOSITION PROCESSES;epi;CUSTOM DESIGN SERVICES IN THE NATURE OF DESIGNING AND DEVELOPING SOFTWARE AND RELATED FABRICATION EQUIPMENT USED IN THE PRODUCTION OF SEMICONDUCTORS USED IN COMMUNICATION DEVICES IN THE NATURE OF CELLULAR PHONES, PERSONAL DIGITAL ASSISTANTS, PAGERS, SOLID STATE LASER PUMPS AND OTHER COMMUNICATION DEVICES USING DIRECT SATELLITE OR OPTICAL FIBER TECHNOLOGY;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. Automated defect sourcing system identifies root-causes of yield excursion due to contamination, process faults, equipment failure and/or handling in timely manner and provides accurate timely feedback to address and contain the sources of yield excursion. A signature bank stores known wafer surface manufacturing defects as defect signatures. The signature of a manufacturing defect pattern is associated with a type of equipment or process, and used to source the manufacturing defects and to provide process control for changing and/or stopping yield excursion during fabrication. A defect signature recognition engine matches wafer defects against the signature bank during wafer fabrication. Once the defect signature is detected during fabrication, handling and/or disposing the root-cause of the corresponding defect is facilitated using messages according to an event handling database. Optionally, a real-time process control for wafer fabrication is provided.