CREASING RULES FOR CUTTING DIES

Brand	Owner	Address	Description
POLYSCORE	CONTAINER GRAPHICS CORPORATION	Suite 104 114 Edinburgh South Drive Cary NC 27511	Creasing Rules for Cutting Dies;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

A pre-process before cutting a wafer is described. The wafer includes a plurality of scribe lines and a plurality of dies defined by the scribe lines, and a material layer covers the wafer. A pre-processing step is performed to remove the material layer on the scribe lines close to the corner regions of the dies. Removing the material layer at the corner regions before cutting the wafer is able to preserve the integrity of the corner regions of the cut dies.