COMPUTER HARDWARE COMPRISING MOTHER BOARDS

Brand	Owner (click to sort)	Address	Description
BARE BONE	DATATECH ENTERPRISES CO., LTD.	7TH FLOOR 85, SEC. 4, PATEH ROAD TAIPEI Taiwan	COMPUTER HARDWARE COMPRISING MOTHER BOARDS, INTERFACE CARDS, POWER SUPPLIES AND KEYBOARDS;
CACHE 386	DATATECH ENTERPRISES CO., LTD.	7TH FLOOR 85, SEC. 4, PATEH ROAD TAIPEI Taiwan	COMPUTER HARDWARE COMPRISING MOTHER BOARDS, INTERFACE CARDS, POWER SUPPLIES AND KEYBOARDS;
ZERO 286	DATATECH ENTERPRISES CO., LTD.	7TH FLOOR 85, SEC. 4, PATEH ROAD TAIPEI Taiwan	COMPUTER HARDWARE COMPRISING MOTHER BOARDS, INTERFACE CARDS, POWER SUPPLIES AND KEYBOARDS;0 286;286;
ZERO 386	DATATECH ENTERPRISES CO., LTD.	7TH FLOOR 85, SEC. 4, PATEH ROAD TAIPEI Taiwan	COMPUTER HARDWARE COMPRISING MOTHER BOARDS, INTERFACE CARDS, POWER SUPPLIES AND KEYBOARDS;386;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

A heat dissipation device for a computer mother board includes a computer enclosure, a heat sink and a mother board. The computer enclosure includes a frame, front and rear panels, two side panels and top and bottom panels respectively connecting to the frame. One side panel is disposed with a support board at the inner side thereof. The heat sink is fixed to one surface of the support board and between the support board and the side panel. The mother board is connected to the other surface of the support board. A plurality of connectors and electronic modules are disposed at one side of the mother board and heat generation modules including a CPU and an electronic chip are disposed at the other side of the mother board. The heat generation modules are in thermal contact with the heat sink.