COLOR APPEARS MARK

Brand Owner Address Description
SUSS MICROTEC SUSS MICROTEC AG Schleissheimer Str. 90 Garching 85748 Germany Color appears in the mark as follows: the letters and plus sign are blue, and the box encompassing the letters SUSS is orange, there being no black in the mark.;optical, electric and electronic equipment for the production, processing and testing of electronic, micromechanical and optomechanical components and in particular semi-conductors and micromechanical components in the nature of mask adjusting devices, wafer samplers, bonders, coaters, and interlinked systems, namely, mask aligners comprising eye-pieces or dual video, microscopes and monitors, lithography clusters comprising mask aligner modules linked to a spin-coating apparatus designed for wafer bumping and wafer level packaging, bonders comprising centre push-ins, disposable and exchangeable plates, electrodes, monitors; cleaners, comprising megasonic nozzles and optical-chemical cleaners, chucks, infra-red light sources, CCD camera; wafer mounting apparatus, comprising process modules which can be used for processes such as pre-cleaning, adhesive coating, heating, wafer mounting, cooling and final cleaning; probed apparatus equipped with a laser cutter or emission microscopes and working with software; test devices for opto-electronics comprising special fiber positioning apparatus, integrating spheres, chuck fixtures for laser bar handling, graphical user interfaces, physical sensors, accelerometers and microphones, software and flexible tools for pattern recognition;machines for the production, processing and testing of electronic, micromechanical and optical components;[ installation, repair and maintenance of the machines for the production, processing and testing of electronic, micromechanical and optical components, and of the optical, electrical and electronic equipment for the production, processing and testing of electronic, micromechanical and optomechanical components and, in particular, semi-conductors and micromechanical components in the nature of mask adjusting devices, wafer samplers, bonders, coaters, and interlinked systems, namely, mask aligners comprising eye-pieces or dual video, microscopes and monitors, lithography clusters comprising mask aligner modules linked to a spin-coating apparatus designed for wafer bumping and wafer level packaging, bonders comprising centre push-ins, disposable and exchangeable plates, electrodes, monitors; cleaners, comprising megasonic nozzles and optical-chemical cleaners, chucks, infra-red light sources, CCD camera; wafer mounting apparatus, comprising process modules which can be used for processes such as pre-cleaning, adhesive coating, heating, wafer mounting, cooling and final cleaning; probed apparatus equipped with a laser cutter or emission microscopes and working with software; test devices for optoelectronics comprising special fiber positioning apparatus, integrating spheres, chuck fixtures for laser bar handling, graphical user interfaces, physical sensors, accelerometers and microphones, software and flexible tools for pattern recognition; installation, maintenance, upgrading, repair of goods in the field of microtechnology ];Color is not claimed as a feature of the mark.;The English translation of the word SUSS in the mark is sweet.;[ Technical support services, namely, development of new technology for others in the field of microtechnology; design and testing for new product development ];
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A method for removing color resist from an exposure alignment mark. In an embodiment, a color resist layer is formed over a color filter substrate with an alignment mark thereon. A concentric tube system is provided with an outer tube surrounding an inner tube. A solvent is injected via the inner tube to contact and dissolve the color resist directly overlying the alignment mark. The dissolved color resist is extracted by the outer tube of the concentric tube system to expose the alignment mark. By repeating the dissolving and extraction steps, all alignment marks on the color filter substrate are consequently uncovered for subsequent exposure alignment.