CMOS IMAGE SENSOR PACKAGING

Brand Owner (click to sort) Address Description
KINGPAK KINGPAK TECHNOLOGY INC. No. 84, Tai-Ho Rd., Chu-Pei 302, Hsin-Chu County Taiwan CMOS image sensor packaging in the nature of integrated circuit assembly; semiconductor packaging in the nature of integrated circuit assembly; manufacturing processing of semiconductors, wafers, and integrated circuits for others; assembly of semiconductors, wafers, and integrated circuits for others; packaging of semiconductors, wafers, and integrated circuits for others in the nature of integrated circuit assembly; metal laminating; laminating of plastic, metal, ceramic or glass sheets; laminating of plastic sheets; molding of plastic materials;Integrated circuit modules; electronic integrated circuits; circuit boards provided with integrated circuits; semiconductor chips; computer chips; integrated circuit modules for use with infrared detectors; chip carriers, namely, semiconductor chip housings; integrated circuits; photoelectric sensors; infrared sensors;KINGPACK;KING PACK;KING PAK;
XSEMI XSEMI CORPORATION 9F.-3, No.1, Huanke 1st Rd., HSINCHU COUNTY ZHUBEI CITY 302 Taiwan CMOS image sensor packaging in the nature of integrated circuit assembly; Semiconductor packaging in the nature of integrated circuit assembly; Manufacturing processing of semiconductors, wafers, and integrated circuits for others; Assembly of semiconductors, wafers, and integrated circuits for others; Packaging of semiconductors, wafers, and integrated circuits for others in the nature of integrated circuit assembly; Metal laminating; Laminating of plastic, metal, ceramic or glass sheets; Laminating of plastic sheets; Molding of plastic materials;Integrated circuit modules; Electronic integrated circuits; Circuit boards provided with integrated circuits; Semiconductor chips; Computer chips; Integrated circuit modules for use with infrared detectors; Chip carriers, namely, semiconductor chip housings; Integrated circuits; Photoelectric sensors; Infrared sensors; Optical lenses; Optical mirrors; Printed circuit boards; Rearview cameras for vehicles;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A CMOS image sensor circuit having a distributed amplifier is disclosed. The CMOS image sensor circuit is constructed using a photo sensor that converts light intensity to into voltage, a reset transistor to charge the photo sensor, and a distributed amplifier to detect and read out the voltage value created by the photo sensor. The distributed amplifier is distributed in the sense that portions of the amplifier circuitry reside within individual pixel circuits that form a CMOS image sensor array. The remainder of the amplifier resides in a column read out circuit that is at the bottom of the CMOS image sensor array.