CHIP WIRE

Brand	Owner	Address	Description
CHIPWIRE	CMP MEDIA INC.	600 Community Drive Manhasset NY 11030	CHIP WIRE;Providing news and information featuring technology pertaining to the semiconductor industry via websites on a global computer network;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

A multi chip package includes a substrate; a first semiconductor chip mounted on the substrate; a second semiconductor chip mounted above the first semiconductor chip; a first bonding wire electrically coupled to a first bonding pad on the first semiconductor chip; and a second bonding wire electrically coupled to a second bonding pad on the second semiconductor chip. At least the first bonding wire is of a coated wire, which comprises a conductive core and an outer insulation coating. At least the first bonding pad is of a multi layered pad, comprising a base pad formed on the first semiconductor chip; a first conductive layer formed on the base pad; and a second conductive layer formed on the first conductive layer.