CHEMICAL SOURCE MATERIAL

Brand Owner (click to sort) Address Description
FLEX-ALD THE BOC GROUP, INC. Legal Services-IP Dept. 575 Mountain Avenue Murray Hill NJ 07974 Chemical source material for the deposition of thin films upon semiconductor wafers for the manufacture of semiconductors;
ION-X NuMat Technologies, Inc. 8025 Lamon Avenue Skokie IL 60077 Chemical source material for the deposition of thin films upon semiconductor wafers for the manufacture of semiconductors;
NANOSMOOTH EVATEC AG HAUPTSTRASSE 1A TRÜBBACH 9477 Switzerland Chemical source material for the deposition of thin films upon semiconductor wafers sold incorporated into semiconductors;Machines and equipment for the manufacture or processing of workpieces such as semiconductor products, photovoltaic detectors, solar cells, light-emitting devices, including LEDs and OLEDs, tools and parts, namely, vacuum plasma treatment systems comprised of a high frequency, high voltage generator, controls, and treatment chamber and structural parts therefor for coating, evaporation, plasma treatment and plasma etching, especially for thin-film coating, evaporation, epitaxy and plasma treatment;NANO SMOOTH;Compounds for use in the manufacture of semiconductors, namely, oxides, nitrides, oxinitrides and carbides for coating glass, semiconductors, metal, ceramic and plastic;Scientific services and research work, namely, drafting, design and scientific analysis of vacuum treatment processes, especially vacuum coating processes such as sputter deposition, chemical gas phase deposition, epitaxy, also with plasma assistance, and of semiconductor products, tools, parts and vacuum treatment plants for manufacturing and processing operations;
NEOFARIT MITSUBISHI GAS CHEMICAL COMPANY, INC. 5-2, Marunouchi 2-Chome Chiyoda-ku, Tokyo 100-8324 Japan Chemical source material for the deposition of thin films upon semiconductor wafers for the manufacture of semiconductors; photoresists;
NEXT NINE NuMat Technologies, Inc. 8025 Lamon Avenue Skokie IL 60077 Chemical source material for the deposition of thin films upon semiconductor wafers for the manufacture of semiconductors; Chemicals for industrial purposes;
PORE BUILDER ASM INTERNATIONAL N.V. Jan van Eijcklaan 10 NL-3723 BC Bilthoven Netherlands Chemical source material in the nature of hydrocarbons, such as hydrocarbons for the deposition of thin films for use in the manufacturing of semiconductors;PORE;
SIGEPLUS ASM INTERNATIONAL N.V. Jan van Eijcklaan 10 NL-3723 BC Bilthoven Netherlands Chemical source material for the deposition of thin films in the manufacturing of semiconductors;
SYNOS TECHNOLOGY Synos Technologies, Inc. 707 Gail Ave Sunnyvale CA 94086 Chemical source material for the deposition of thin films upon substrates, including semiconductor chips, semiconductor wafers, solar chips, flat panel displays and other porous media or particles;
SYNOS TECHNOLOGY SYNOS TECHNOLOGY, INC. www.synos.com 3191 Laurelview Court Fremont CA 94538 Chemical source material for the deposition of thin films upon substrates, in the nature of semiconductor chips, semiconductor wafers, and solar semiconductor chips, for the manufacture of semiconductors; for use with lithium ion batteries and carbon fiber; industrial chemical source material for the deposition of thin films upon substrates in the nature of semiconductor chips, semiconductor wafers, solar chips, flat panel displays and other porous media and particles;
TRIVIAL TRANSFER GRAPHENE ACS Material 7 Willey Creek Road #402 Exeter NH 03833 Chemical source material for the deposition of thin films upon semiconductor wafers for the manufacture of semiconductors;TRANSFER GRAPHENE;
 

Where the owner name is not linked, that owner no longer owns the brand

   
Technical Examples
  1. A heat sink assembly in which the interface material is chemically bonded to both the heat source material and the heat sink material. The chemical bonding can lower the contact resistance that would otherwise exist using conventional adhesives to attach the heat sink to the heat source. The chemical bonding achieved between the respective materials can be, for example, ionic, covalent or metallic bonds, depending on the characteristic of the materials used to make the heat source, the interface material, and the heat sink.