CHEMICAL RAW MATERIALS

Brand Owner (click to sort) Address Description
CM CHI MEI CORPORATION No. 59-1, Sanjiazi, Rende District Tainan City 71702 Taiwan chemical raw materials, namely, acrylonitrile styrene copolymer (AS) resin, acrylonitrile-butadiene styrene copolymer (ABS) resin, acrylic resin, general purpose polystyrene, high impact polystyrene, all for use in further manufacturing;
DYCO DYCE SALES & ENGINEERING SERVICE CO., INC. 1353 TAYLOR PLACE BILLINGS MT 59101 CHEMICAL RAW MATERIALS, CHEMICAL REAGENTS, CHEMICAL PRODUCTS FOR INDUSTRIAL PURPOSES, AND ANTI-FREEZE PREPARATIONS;
DYNOSPHERES DYNO INDUSTRIER A.S TOLLBUGT. 22 OSLO 1 Norway CHEMICAL RAW MATERIALS FOR IN VITRO USE, NAMELY MONODISPERSE POLYMER PARTICLES MADE FROM POLYSTYRENE, POLYVINYL CHLORIDE, POLYDIVINYLBENZENE, POLYACRYLATES, AND VARIOUS COPOLYMERS FOR USE AS REGAENTS, SEPARATION AGENTS, CARRIERS, EXCHANGE RESINS, MATTING AGENTS AND CHROMOTOGRAPHY MEDIA;
EMPERA BP AMOCO P.L.C. Britannic House, 1 Finsbury Circus London EC2M 7BA United Kingdom CHEMICAL RAW MATERIALS, NAMELY GENERAL PURPOSE POLYSTYRENE, IMPACT POLYSTYRENE AND POLYSTYRENE-BASED COMPOUNDS, ALL FOR USE IN MANUFACTURING;
IPRIGEN NUTRATECH, INC. 10 Washington Avenue Fairfield NJ 07004 CHEMICAL RAW MATERIALS FOR THE MANUFACTURE OF HEALTH AND NUTRITIONAL SUPPLEMENTS;
RIGIPORE O&D TRADING LIMITED CHERTSEY ROAD, SUNBURY ON THAMES MIDDLESEX TW 16 7BP United Kingdom CHEMICAL RAW MATERIALS, NAMELY EXPANDABLE POLYSTYRENE FOR USE IN MANUFACTURING;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. Method and structure for optimizing dual damascene patterning with polymeric dielectric materials are disclosed. Certain embodiments of the invention comprise polymeric sacrificial light absorbing materials ("polymer SLAM") functionalized to have a controllable solubility switch wherein such polymeric materials have substantially the same etch rate as conventionally utilized polymeric dielectric materials, and subsequent to chemical modification of solubility-modifying protecting groups comprising the SLAM materials by thermal treatment or in-situ generation of an acid, such SLAM materials become soluble in weak bases, such as those conventionally utilized to remove materials in lithography treatments.