CELER BASE

Brand Owner (click to sort) Address Description
CELERBASE CELERDATA INC 850 New Burton Road, Suite 201 Dover DE 19904 CELER BASE;Cloud storage services for electronic data; Computer programming services for commercial analysis and reporting; Computer systems analysis; Consulting services in the field of cloud computing; Database development services; Development and creation of computer programmes for data processing; Development of computer platforms; Electronic data storage; Information technology consulting services; Software as a service (SAAS) services featuring software for use in database management;
CELERBASE CELERDATA INC 850 New Burton Road, Suite 201 Dover DE 19904 CELER BASE;Analysis of advertising response; Business data analysis; Market research by means of a computer database; Marketing the goods and services of others; Providing and rental of advertising space on the internet; Providing information about commercial business and commercial information via the global computer network; Statistical evaluations of marketing data; Systemization of information into computer databases; Updating and maintenance of data in computer databases;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. Systems and methods for assembling microelectronic devices that have a base die and a conventional wire-bond die stacked on the base die. In one embodiment of a method in accordance with the invention, a base die is placed on a substrate and then a first stacked die is subsequently stacked on the base die. The first stacked die is stacked on the base die in a single pass through a die attach machine without first storing or otherwise processing the base die/substrate assembly in a separate machine. The stacked die, moreover, can be stacked onto the base die before heating the base die to reflow a solder or otherwise attach the base die to the substrate. After stacking the first stacked die on the base die, the complete die assembly can be heated to (a) secure the base die to the substrate, and (b) secure the first stacked die to the base die.