BUMPING AROUND

Brand	Owner	Address	Description
BUMPIN' AROUND	JOSHU, JARRAN R	PO Box 94208 Phoenix AZ 850704208	BUMPING AROUND;Shirts; Sweaters; Tank tops; T-shirts;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

An interface assembly (20) and method for testing a semiconductor wafer prior to performing a flip chip bumping process are provided. The interface assembly includes a flip chip bonding pad (24) having a region (28) for performing the bumping process. A test pad (22) is integrally constructed with the bonding pad and includes a probe region (26) for performing wafer-level testing prior to performing the bumping process. The integral construction of the bonding and testing pads avoids, for example, an introduction of propagation delays to test signals passing therethrough, thereby improving the accuracy and reliability of wafer test results.