BUFFING POLISHING COMPOSITIONS APPLICABLE

Brand	Owner (click to sort)	Address	Description
ARTAB	JASON INCORPORATED	1100 RESOURCE DRIVE SUITE 1 BROOKLYN HEIGHTS OH 44131	Buffing and Polishing Compositions Applicable to the Treatment of Metals, Plastics, Leather, and Other Solid Materials and Compositions Generally, which Are Susceptible of Polishing by Abrasive Action;
ARTAB	Lea Manufacturing Co.; The	16 Cherry Ave. Waterbury CT	Buffing and Polishing Compositions Applicable to the Treatment of Metals, Plastics, Leather, and Other Solid Materials and Compositions Generally, which Are Susceptible of Polishing by Abrasive Action;
PLASTAB	LEA MANUFACTURING COMPANY, THE	237 EAST AURORA STREET WATERBURY CT 06720	BUFFING AND POLISHING COMPOSITIONS APPLICABLE TO THE TREATMENT OF METALS, PLASTICS, LEATHER, AND OTHER SOLID MATERIALS, AND COMPOSITIONS GENERALLY WHICH ARE SUSCEPTIBLE OF POLISHING BY ABRASIVE ACTION;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

A method for chemical mechanical polishing (CMP) wafers having high aspect ratio surface topography. A wafer is positioned on a plate. A polishing pad is coupled to a platen. A polishing solution (e.g., slurry) is added between the polishing pad and the wafer. CMP is performed on the wafer by creating a relative movement between the polishing pad and the wafer. The polishing pad removes substantially all residual material from the channels. To accomplish this, the polishing pad has a compressibility of at least 5% at a polishing pressure of about 4 psi.