BOND TESTING MACHINES USE

Brand	Owner (click to sort)	Address	Description
ROYCE	V-TEK, INC.	751 SUMMIT AVENUE MANKATO MN 56001	Bond testing machines for use in photonic and semiconductor manufacturing industries;Machine tools, namely, assembly tools for use in photonic and semiconductor manufacturing industries;
ROYCE	ROYCE INSTRUMENTS	831 LATOUR COURT, SUITE C NAPA CA 94558	Bond testing machines for use in photonic and semiconductor manufacturing industries;Machine tools, namely, assembly tools for use in photonic and semiconductor manufacturing industries;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

An integrated device includes a redundant bond pad for accessing internal circuitry in the event that the main bond pad for that circuitry is difficult to access with testing equipment. Signals from the redundant bond pad are biased to ground during normal operations of the integrated device. In order to test the relevant internal circuitry, a voltage is applied to a Test Mode Enable bond pad, overcoming the bias that grounds the redundant bond pad. In addition, the signal from the Test Mode Enable bond pad serves to ground any transmission from the main bond pad. As a result, the redundant bond pad may be used to test the relevant internal circuitry given its accessible location in relation to the testing equipment.