BIBLES SEPARATE PORTIONS THEREOF

Brand Owner (click to sort) Address Description
AMPLIFICADA The Lockman Foundation 900 S. Euclid St. La Habra CA 90631 Bibles and separate portions thereof, namely, booklets featuring portions of the bible;The foreign wording in the mark translates into English as Amplified.;
INTERNATIONAL STANDARD BIBLE LOCKMAN FOUNDATION, THE 900 South Euclid La Habra CA 90631 bibles and separate portions thereof, and concordances to the bible and portions thereof;
ISB LOCKMAN FOUNDATION, THE 900 South Euclid La Habra CA 90631 bibles and separate portions thereof, and concordances to the bible and portions thereof;
LA BIBLIA DE LAS AMERICAS LOCKMAN FOUNDATION, THE 900 South Euclid La Habra CA 90631 Bibles and separate portions thereof, and concordances to the Bible and portions thereof;BIBLIA;The English translation of the Spanish words LA BIBLIA DE LAS AMERICAS is the Bible of the Americas.;
LBLA LOCKMAN FOUNDATION, THE 900 South Euclid La Habra CA 90631 bibles and separate portions thereof, and concordances to the bible and portions thereof;
LEGACY STANDARD BIBLE The Lockman Foundation 900 S. Euclid St. La Habra CA 90631 Bibles and separate portions thereof; Printed books in the field of religion;BIBLE;
NBL The Lockman Foundation 900 S. Euclid St. La Habra CA 90631 Bibles and separate portions thereof;NUEVA BIBLIA LATINOAMERICANA;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A ground-enhanced semiconductor package and a lead frame used in the package are provided. The semiconductor package includes a lead frame having a die pad, a plurality of tie bars connected with and supporting the die pad, a plurality of leads surrounding the die pad, and a ground structure, wherein the ground structure comprises at least one of first ground portions connected to the tie bars, and/or at least one of second ground portions connected to the die pad, and wherein the first ground portions are separate from each other, and the second ground portions are separate from each other; at least one chip mounted on the die pad and electrically connected to the leads and the ground structure; and an encapsulation body for encapsulating the chip and the lead frame. The separately-arranged ground portions allow thermal stresses to be released from the ground structure without rendering deformation issues.