BASE WELL

Brand	Owner (click to sort)	Address	Description
BASEWELL	DÜMMEN GROUP B.V.	Coldenhovelaan 6 De Lier 2678PS Netherlands	BASE WELL;Propagation, breeding, cultivation, and selection of ornamental plants, plant material, and seeds; horticultural services in the nature of producing plants, plant material, and seed;Packaging containers of plastic; packaging materials, namely, non-metal strips and cartridges for holding living plants and live plant cuttings; containers, not of metal, for commercial use;Living plants and live plant cuttings;
BASEWELL	Dongguan Kooling Electrical Co.,LTD	Bldg.D, Sihai Industrial Park Shanxia,Hengli Town Dongguan, Guandong 523000 China	BASE WELL;Color is not claimed as a feature of the mark.;Air conditioning installations; Air cooling apparatus; Air filtering installations; Air purifying apparatus and machines; Air sterilisers; Germicidal lamps for purifying air; Refrigerating appliances and installations; Refrigerating cabinets; Water sterilizers; Wine cellars, electric;
BASEWELL	BASEWELL, INC.	1707 TURNBERRY LANE ALLEN TX 75002	BASE WELL;Software as a service (SAAS) services featuring online platform to streamline the collection of data for training and engagement of employees in various aspects of their employment to improve productivity and workplace environment;
BASEWELL	Basewell	1707 Turnberry Lane Allen TX 75002	BASE WELL;Software as a service (SAAS) services featuring online platform to streamline the collection of data for training and engagement of employees in various aspects of their employment to improve productivity and workplace environment;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

Systems and methods for assembling microelectronic devices that have a base die and a conventional wire-bond die stacked on the base die. In one embodiment of a method in accordance with the invention, a base die is placed on a substrate and then a first stacked die is subsequently stacked on the base die. The first stacked die is stacked on the base die in a single pass through a die attach machine without first storing or otherwise processing the base die/substrate assembly in a separate machine. The stacked die, moreover, can be stacked onto the base die before heating the base die to reflow a solder or otherwise attach the base die to the substrate. After stacking the first stacked die on the base die, the complete die assembly can be heated to (a) secure the base die to the substrate, and (b) secure the first stacked die to the base die.