BALLS USED IN MEASURING

Brand	Owner (click to sort)	Address	Description
ATLAS	SKF USA INC.	Corporate Headquarters 890 Forty Foot Road, PO Box 352 Lansdale PA 19446	BALLS USED IN MEASURING AND TESTING INSTRUMENTS INCLUDING VISCOSITY TESTING INSTRUMENTS, INSTRUMENTS FOR TESTING THE LUBRICATING QUALITY OF OIL, SCALES TO DETERMINE WEIGHTS, CALCULATING MACHINES, SPEEDOMETERS, THERMOSTATIC CONTROL APPARATUS, INSTRUMENTS FOR MEASURING THE HARDNESS OF METALS, COUNTERS, AND APERTURE SIZINGS;
ATLAS	SKF USA INC.	Corporate Headquarters 890 Forty Foot Road, PO Box 352 Lansdale PA 19446	BALLS USED IN MEASURING AND TESTING INSTRUMENTS INCLUDING VISCOSITY TESTING INSTRUMENTS, INSTRUMENTS FOR TESTING THE LUBRICATING QUALITY OF OIL, SCALES TO DETERMINE WEIGHTS, CALCULATING MACHINES, SPEEDOMETERS, THERMOSTATIC CONTROL APPARATUS, INSTRUMENTS FOR MEASURING THE HARDNESS OF METALS, COUNTERS, AND APERTURE SIZINGS;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

A method of packaging an integrated circuit die includes the steps of loading an array of soft conductive balls into recesses formed in a platen and locating the platen in a first part of a mold cavity. A second part of the mold is pressed against the balls to flatten a surface of the balls. A first mold compound then is injected into the mold cavity such that the mold compound surrounds exposed portions of the balls. The balls are removed from the platen and a first side of an integrated circuit die is attached to the balls. Die bonding pads on a second side of the die are electrically connected to respective ones of the balls surrounding the die, and then the die, the electrical connections, and a top portion of the conductive balls is encapsulated with a second mold compound.