ATHLETIC PROTECTIVE PADS TYPE

Brand	Owner	Address	Description
KISPORTS	Zhang Jingjing	No.63 Jinshui West Road, Wuquan Town Wuyang County Luohe, Henan 462400 China	Athletic protective pads for type and purpose; Athletic sporting goods, namely, athletic wrist and joint supports; Athletic wraps for supporting hands, wrists during exercise; Baby multiple activity toys; Body-building apparatus; Candle holders for Christmas trees; Cases for play accessories; Children's dress up accessories, namely, toy helmets for play; Children's educational toys for developing fine motor, cognitive, counting skills; Children's toy bicycles other than for transport; Christmas tree ornaments incorporating a fire alarm function; Christmas tree ornaments and decorations; Christmas tree ornaments with a music feature; Christmas tree ornaments, namely, bells; Christmas trees of synthetic material; Climbers' harness; Dolls and accessories therefor; Electronic game equipment with a watch function; Wrist guards for athletic use;The wording KISPORTS has no meaning in a foreign language.;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

Methods for packaging microelectronic devices, microelectronic workpieces having packaged dies, and microelectronic devices. One aspect of the invention is directed toward a microelectronic workpiece comprising a substrate having a device side and a backside. In one embodiment, the microelectronic workpiece further includes a plurality of dies formed on the device side of the substrate, a dielectric layer over the dies, and a plurality of bond-pads on the dielectric layer. The dies have integrated circuitry and a plurality of bond-pads electrically coupled to the integrated circuitry. The ball-pads are arranged in ball-pad arrays over corresponding dies on the substrate. The ball-pads of one array, for example, are electrically coupled to the bond-pads of the corresponding die. The microelectronic workpiece of this embodiment further includes a protective film over the dielectric layer. In one embodiment, the workpiece further includes solder balls attached to corresponding ball-pads, and the protective film covers the dielectric layer in between the solder balls. The solder balls in this embodiment also have exposed contact sites such that the protective film can cover side portions of the solder balls but not a top surface of the solder balls.