ATHLETIC PROTECTIVE PADS KITEBOARDING

Brand Owner Address Description
ANEMOI Direct Development Inc 5676 indigo crossing drive rockledge FL 32955 Athletic protective pads for kiteboarding, surfing, paragliding, skateboarding, and windsurfing; Bags especially designed for surfboards; Bags for skateboards; Bindings for snowboards; Boards used in the practice of water sports; Body boards; Cases specially adapted for sports equipment; Kite boards; Kite handles; Kite lines; Kite parts; Kite reels; Kite string; Kites; Paragliders; Pumps for inflating sports equipment, namely, kites, floats for watersports, air mattresses for recreational use; Sail board foot restraints; Sail boards; Skateboard decks; Skim boards; Snow boards; Surf boards; Wake boards;Athletic apparel, namely, shirts, pants, jackets, footwear, hats and caps, athletic uniforms; Baseball caps; Bermuda shorts; Board shorts; Caps; Caps with visors; Golf shirts; Hooded sweat shirts; Long-sleeved shirts; Moisture-wicking sports pants; Moisture-wicking sports shirts; Pants; Pique shirts; Polo shirts; Rain jackets; Shirts; Shirts and short-sleeved shirts; Short-sleeved or long-sleeved t-shirts; Shorts; Snowboard gloves; Surf wear; Sweat shirts; Sweat shorts; Swim trunks; Swim wear; Swim wear for gentlemen and ladies; Swimming trunks; T-shirts; Triathlon clothing, namely, triathlon tights, triathlon shorts, triathlon singlets, triathlon shirts, triathlon suits; Waterproof jackets and pants; Wearable garments and clothing, namely, shirts; Wet suit gloves; Wetsuits; Wind resistant jackets; Wind shirts;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. Methods for packaging microelectronic devices, microelectronic workpieces having packaged dies, and microelectronic devices. One aspect of the invention is directed toward a microelectronic workpiece comprising a substrate having a device side and a backside. In one embodiment, the microelectronic workpiece further includes a plurality of dies formed on the device side of the substrate, a dielectric layer over the dies, and a plurality of bond-pads on the dielectric layer. The dies have integrated circuitry and a plurality of bond-pads electrically coupled to the integrated circuitry. The ball-pads are arranged in ball-pad arrays over corresponding dies on the substrate. The ball-pads of one array, for example, are electrically coupled to the bond-pads of the corresponding die. The microelectronic workpiece of this embodiment further includes a protective film over the dielectric layer. In one embodiment, the workpiece further includes solder balls attached to corresponding ball-pads, and the protective film covers the dielectric layer in between the solder balls. The solder balls in this embodiment also have exposed contact sites such that the protective film can cover side portions of the solder balls but not a top surface of the solder balls.