ASSEMBLY DEVICES

Brand	Owner (click to sort)	Address	Description
MTRAB	MASCHINENFABRIK REINHAUSEN GMBH	Falkensteinstraße 8 Regensburg 93059 Germany	[ ASSEMBLY OF DEVICES AND SAFETY EQUIPMENT TO THE ORDER AND SPECIFICATION OF OTHERS FOR CONTROL, ADJUSTMENT, MONITORING AND CHECKING THE FUNCTIONAL STATUS AND THE FUNCTIONAL CAPABILITY OF OIL-INSULATED TRANSFORMERS, SWITCHING DEVICES AND TAP CHANGERS IN TRANSFORMERS, namely, AIR DEMOISTURIZERS AND BREATHERS ];DEVICES AND SAFETY EQUIPMENT FOR CONTROL, ADJUSTMENT, MONITORING AND CHECKING THE FUNCTIONAL STATUS AND THE FUNCTIONAL CAPABILITY OF OIL INSULATED TRANSFORMERS, SWITCHING DEVICES AND TAP CHANGERS IN TRANSFORMERS, NAMELY AIR DEMOISTURIZERS AND BREATHERS;[ INSTALLATION, MAINTENANCE AND REPAIR OF DEVICES AND SAFETY EQUIPMENT FOR CONTROL, ADJUSTMENT, MONITORING AND CHECKING THE FUNCTIONAL STATUS AND THE FUNCTIONAL CAPABILITY OF OIL-INSULATED TRANSFORMERS, SWITCHING DEVICES AND TAP CHANGERS IN TRANSFORMERS, namely, AIR DEMOISTURIZERS AND BREATHERS ];Color is not claimed as a feature of the mark.;
TRUFORM	BARRY-WEHMILLER COMPANIES, INC.	8020 Forsyth Blvd. St. Louis MO 63105	Assembly devices, being parts of machines used to form planar web material into a tubular configuration and then sealed to form pouches for packaging products; packaging machine;TRUE FORM;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

A multichip assembly includes semiconductor devices or semiconductor device components with outer connectors on peripheral edges thereof. The outer connectors are formed by creating via holes along boundary lines between adjacent, unsevered semiconductor devices, or semiconductor device components, then plating or filling the holes with conductive material. When adjacent semiconductor devices or semiconductor device components are severed from one another, the conductive material in each via between the semiconductor devices is bisected. The semiconductor devices and components of the multichip assembly may have different sizes, as well as arrays of outer connectors with differing diameters and pitches. Either or both ends of each outer connector may be electrically connected to another aligned outer connector or contact area of another semiconductor device or component. Assembly in this manner provides a low-profile stacked assembly.