ADHESIVE USE

Brand Owner (click to sort) Address Description
847 Trim-Tex, Inc. 3700 West Pratt Avenue Lincolnwood IL 60712 adhesive for use in the installation of drywall -trimming accessories;
DRYLOCK W. L. Gore & Associates, Inc. 555 Paper Mill Road Newark DE 19711 adhesive for use in the manufacture of clothing;
GL-187 LOHMANN PRECISION DIE CUTTING 3000 EARHART COURT, SUITE #155 HEBRON KY 41018 Adhesive for use in the manufacture of diagnostic test strips for human, veterinary, agriculture, and environmental testing;
GL-187 G&L PRECISION DIE CUTTING 3000 EARHART COURT SUITE 155 HEBRON KY 41048 Adhesive for use in the manufacture of diagnostic test strips for human, veterinary, agriculture, and environmental testing;
GL-187 G&L Precision Die Cutting, Inc. 1766 Junction Avenue San Jose CA 95112 Adhesive for use in the manufacture of diagnostic test strips for human, veterinary, agriculture, and environmental testing;
ONE STEP ADVANTAGE ROYAL ADHESIVES AND SEALANTS WLB - Law - Trademarks 2001 West Washington Street South Bend IN 46628 Adhesive for use in the construction of roofs;
ROLL TAC ULANO, BERNARD 15205 Avenue 292 Visalia CA 93292 adhesive for use in the silk screen industry (to hold fabric during printing);TAC;
SECURANCE ATO FINDLEY INC. 11320 Watertown Plank Road Wauwatosa WI 53226 ADHESIVE FOR USE IN THE MANUFACTURE OF PERSONAL CARE PRODUCTS;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. An adhesive layer containing a photo-curing adhesive and a thermosetting adhesive is formed on a semiconductor wafer in which a plurality of semiconductor elements are formed. The adhesive layer and the semiconductor wafer are adhered together by selectively exposing the adhesive layer to light and curing the photo-curing adhesive contained in the adhesive layer on the peripheral portion of each semiconductor element. By developing the photo-curing adhesive, the adhesive layer in an area that has not been exposed is removed. Whether the pattern of the adhesive layer is satisfactory or not is determined for each semiconductor element. A lid part is placed on the adhesive layer of the semiconductor element determined to be satisfactory, and the adhesive layer and the lid part are adhered together by heating the adhesive layer and causing the thermosetting adhesive contained in the adhesive layer to exhibit adhesive properties.